ZHCSGN0A August   2017  – September 2017 TUSB214-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化电路原理图
      2.      显示屏
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 EQ
      2. 7.3.2 DC BOOST
      3. 7.3.3 BC1.2 CDP Support
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low Speed (LS) Mode
      2. 7.4.2 Full Speed (FS) Mode
      3. 7.4.3 High Speed (HS) Mode
      4. 7.4.4 Shutdown Mode
      5. 7.4.5 I2C Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Test Procedure to Construct USB High Speed Eye Diagram
          1. 8.2.2.1.1 For a Host Side Application
          2. 8.2.2.1.2 For a Device Side Application
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Electrical Characteristics

over operating free-air temperature and voltage range (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
POWER
IACTIVE_HS High-speed (HS) active curent USB channel = HS mode; 480 Mbps traffic; VCC = 3.3V; VCC supply stable; DC Boost = 60 mV 22 30 mA
IIDLE_HS High-speed idle current USB channel = HS mode; no traffic; VCC = 3.3V; VCC supply stable; DC Boost = 60 mV 14 22 mA
ISUSPEND_HS High-speed suspend current USB channel = HS suspend mode; VCC = 3.3V; VCC supply stable 0.55 1.5 mA
IFS_LS Full/Low speed current USB channel = FS mode or LS mode; VCC = 3.3V 0.6 1.5 mA
IDISCONNECT Disconnect current Host side application; No device attachment; VCC = 3.3V 0.7 1.5 mA
IRSTN Disable current RSTN driven low; VCC supply stable; VCC = 3.3V 13 80 µA
ILKG_FS Pin fail-safe leakage current for SDA, SCL, DC_BOOST, DxP/N, RSTN VCC = 0 V; Pin at 3.6 V 40 µA
RSTN
VIH High-level input voltage VCC = 3.0V 2 3.6 V
VIL Low-level input voltage VCC = 3.6V 0 0.8 V
IIH High-level input current VIH = 3.6 V -4 4 µA
IIL Low-level input current VIL = 0 V -11 11 µA
EQ
REQ External pull-down resistor on EQ pin. AC Boost Level 0 160 Ω
AC Boost Level 1 1.4 2 kΩ
AC Boost Level 2 3.7 3.9 kΩ
AC Boost Level 3 6 kΩ
CD, ENA_HS
VOH High-level output voltage IO = -50µA 2.4 V
VOL Low-level output voltage IO = 50µA 0.4 V
SCL, SDA
CI2CBUS I2C Bus capacitance 4 150 pF
VIH SDA and SCL input high level voltage VCC = 3.0V 2 3.6 V
VIL SDA and SCL input low level voltage VCC = 3.6V 0.8 V
VSDA_OL SDA  low level output voltage 4.7kΩ pullup to 3.6V;  VCC = 3.0V 0.4 V
ISDA_OL SDA  low level output current VCC = 3.6V 1.1 mA
DC_BOOST
VIH High-level input voltage VCC = 3.3V 2.4 3.6 V
VIM Mid-level input voltage VCC = 3.3V 1.6 V
VIL Low-level input voltage VCC = 3.3V 0 0.4 V
DxP, DxM
CIO_DXX Capacitance to GND Measured with LCR meter and device powered down. 1 MHz sinusoid, 30 mVpp ripple 2.4 pF