1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1Absolute Maximum Ratings
    2. 7.2ESD Ratings
    3. 7.3Recommended Operating Conditions
    4. 7.4Thermal Information
    5. 7.5Electrical Characteristics
    6. 7.6Timing Requirements
    7. 7.7Switching Characteristics
    8. 7.8Typical Characteristics
  8. Detailed Description
    1. 8.1Overview
      1. 8.1.1VBUS Capacitance
      2. 8.1.2USB Data Communications
    2. 8.2Functional Block Diagram
    3. 8.3Feature Description
      1. 8.3.1 ENSRC
      2. 8.3.2 USB Type-C CC Logic (CC1, CC2)
      3. 8.3.3 USB PD BMC Transmission (CC1, CC2, VTX)
      4. 8.3.4 USB PD BMC Reception (CC1, CC2)
      5. 8.3.5 Discharging (DSCG, VPWR)
        1. 8.3.5.1Discharging after a Fault (VPWR)
      6. 8.3.6 Configuring Voltage Capabilities (HIPWR)
      7. 8.3.7 Configuring Power Capabilities (PSEL, PCTRL, HIPWR)
      8. 8.3.8 Gate Driver (GDNG, GDNS)
      9. 8.3.9 Fault Monitoring and Protection
        1. 8.3.9.1Over/Under Voltage (VBUS)
        2. 8.3.9.2Over-Current Protection (ISNS, VBUS)
        3. 8.3.9.3System Fault Input (GD, VPWR)
      10. 8.3.10Voltage Control (CTL1, CTL2,CTL3)
      11. 8.3.11Sink Attachment Indicator (DVDD)
      12. 8.3.12Power Supplies (VAUX, VDD, VPWR, DVDD)
      13. 8.3.13Grounds (AGND, GND)
      14. 8.3.14Output Power Supply (DVDD)
    4. 8.4Device Functional Modes
      1. 8.4.1Sleep Mode
      2. 8.4.2Checking VBUS at Start Up
  9. Application and Implementation
    1. 9.1Application Information
      1. 9.1.1System-Level ESD Protection
      2. 9.1.2Using ENSRC to Enable the Power Supply upon Sink Attachment
      3. 9.1.3 Use of GD Internal Clamp
      4. 9.1.4Resistor Divider on GD for Programmable Start Up
      5. 9.1.5Selection of the CTL1, CTL2, and CTL3 Resistors (R(FBL1), R(FBL2), and R(FBL3))
      6. 9.1.6Voltage Transition Requirements
      7. 9.1.7VBUS Slew Control using GDNG C(SLEW)
      8. 9.1.8Tuning OCP using RF and CF
    2. 9.2Typical Applications
      1. 9.2.1Typical Application, A/C Power Source (Wall Adapter)
        1. 9.2.1.1Design Requirements
        2. 9.2.1.2Detailed Design Procedure
          1. 9.2.1.2.1Power Pin Bypass Capacitors
          2. 9.2.1.2.2Non-Configurable Components
          3. 9.2.1.2.3Configurable Components
        3. 9.2.1.3Application Curves
      2. 9.2.2Typical Application, D/C Power Source
        1. 9.2.2.1Design Requirements
        2. 9.2.2.2Detailed Design Procedure
          1. 9.2.2.2.1Power Pin Bypass Capacitors
          2. 9.2.2.2.2Non-Configurable Components
          3. 9.2.2.2.3Configurable Components
        3. 9.2.2.3Application Curves
    3. 9.3System Examples
      1. 9.3.1D/C Power Source (Power Hub)
      2. 9.3.2A/C Power Source (Wall Adapter)
      3. 9.3.3Dual-Port A/C Power Source (Wall Adaptor)
      4. 9.3.4D/C Power Source (Power Hub with 3.3 V Rail)
  10. 10Power Supply Recommendations
    1. 10.1VDD
    2. 10.2VPWR
  11. 11Layout
    1. 11.1Port Current Kelvin Sensing
    2. 11.2Layout Guidelines
      1. 11.2.1Power Pin Bypass Capacitors
      2. 11.2.2Supporting Components
    3. 11.3Layout Example
  12. 12器件和文档支持
    1. 12.1文档支持
    2. 12.2接收文档更新通知
    3. 12.3社区资源
    4. 12.4商标
    5. 12.5静电放电警告
    6. 12.6Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
订购信息