ZHCSGK9A April 2017  – July 2017 TPS22971

PRODUCTION DATA. 

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1Absolute Maximum Ratings
    2. 6.2ESD Ratings
    3. 6.3Recommended Operating Conditions
    4. 6.4Thermal Information
    5. 6.5Electrical Characteristics
    6. 6.6Switching Characteristics
    7. 6.7Typical DC Characteristics
    8. 6.8Typical AC Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1Overview
    2. 8.2Functional Block Diagram
    3. 8.3Feature Description
      1. 8.3.1On and Off Control
      2. 8.3.2Controlled Turn-On
      3. 8.3.3Power Good (PG)
      4. 8.3.4Quick Output Discharge (QOD)
    4. 8.4Device Functional Modes
  9. Application and Implementation
    1. 9.1Application Information
      1. 9.1.1Thermal Consideration
      2. 9.1.2PG Pull Up Resistor
      3. 9.1.3Power Sequencing
    2. 9.2Typical Application
      1. 9.2.1Design Requirements
      2. 9.2.2Detailed Design Procedure
        1. 9.2.2.1Maximum Voltage Drop and On-Resistance
        2. 9.2.2.2Managing Inrush Current
      3. 9.2.3Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1Layout Guidelines
    2. 11.2Layout Example
  12. 12器件和文档支持
    1. 12.1文档支持
      1. 12.1.1相关文档
    2. 12.2接收文档更新通知
    3. 12.3社区资源
    4. 12.4商标
    5. 12.5静电放电警告
    6. 12.6Glossary
  13. 13机械、封装和可订购信息

Specifications

Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
VIN Input voltage–0.34V
VOUT Output voltage–0.34V
VON ON voltage–0.34V
VPG PG voltage–0.34V
IMAX Maximum continuous switch current3A
IPLS Maximum pulsed switch current, pulse < 300-µs, 2% duty cycle4A
TJ Maximum junction temperatureInternally Limited
Tstg Storage temperature–65150°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

ESD Ratings

VALUEUNIT
V(ESD) Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MINMAXUNIT
VIN Input voltage0.653.6V
VOUT Output voltageVIN V
VIH High-level input voltage, ON0.93.6V
VIL Low-level input voltage, ON00.45V
TJ Operating temperature–40125°C
TA Operating free-air temperature–40105°C
CT CT pin capacitor voltage rating7V

Thermal Information

THERMAL METRIC (1) TPS22971UNIT
YZP (DSBGA)
8 PINS
RθJA Junction-to-ambient thermal resistance130°C/W
RθJC(top) Junction-to-case (top) thermal resistance54°C/W
RθJB Junction-to-board thermal resistance51°C/W
ψJT Junction-to-top characterization parameter1°C/W
ψJB Junction-to-board characterization parameter50°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

Electrical Characteristics

Unless otherwise noted, VIN = 0.65 V to 3.6 V
PARAMETERTEST CONDITIONSTA MINTYPMAXUNIT
IQ Quiescent currentVOUT = Open, Switch enabledVIN > 1.2 V–40°C to +85°C3065µA
–40°C to +105°C75
VIN ≤ 1.2 V–40°C to +85°C2050
–40°C to +105°C55
ISD Shutdown currentVOUT = GND, Switch disabledVIN > 1.8 V–40°C to +85°C17.5µA
–40°C to +105°C18
VIN ≤ 1.8 V–40°C to +85°C0.95.5
–40°C to +105°C9.5
RON ON-resistanceIOUT = –200 mAVIN ≥ 1.8 V25°C6.710
–40°C to +85°C12
–40°C to +105°C12
VIN = 1.2 V25°C6.910
–40°C to +85°C12
–40°C to +105°C13
VIN = 1.05 V25°C7.210.5
–40°C to +85°C13
–40°C to +105°C14
VIN = 0.65 V25°C8.914
–40°C to +85°C18
–40°C to +105°C19
RPD Output pull down resistance(1) IOUT = 3 mA, Switch disabledVIN = 3.6 V–40°C to +105°C150Ω
VIN = 0.65 V–40°C to +105°C710Ω
ION ON input leakage currentVON =0 V to 3.6 V–40°C to +105°C0.1µA
IPG,LK Leakage current into PG pinVPG = 0 V to 3.6 VVON ≤ VIL –40°C to +105°C0.18.5µA
VPG,OL PG output low voltageVPG = 0 V to 3.6 VVON ≥ VIH, IPG = 1 mA–40°C to +105°C0.2V
TSD Thermal shutdownTJ rising170°C
TSD, HYS Thermal shutdown hysteresisTJ falling30°C
See the Quick Output Discharge (QOD) section.

Switching Characteristics

All typical values are at 25°C unless otherwise noted
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
VIN = 3.6 V
tON Turn-On timeCT = 0 pF54µs
CT = 1000 pF198
CT = 10000 pF1520
tR VOUT Rise timeCT = 0 pF35
CT = 1000 pF150
CT = 10000 pF1230
tPG,ON PG Turn-On timeCT = 0 pF134
CT = 1000 pF314
CT = 10000 pF1990
tPG,OFF PG Turn-Off time1.9
tOFF Turn-Off time3.5
tF VOUT Fall timeCL = 0.1 µF, RL = 10 Ω2.1
VIN = 1.8 V
tON Turn-On timeCT = 0 pF41µs
CT = 1000 pF126
CT = 10000 pF857
tR VOUT Rise timeCT = 0 pF21
CT = 1000 pF82
CT = 10000 pF628
tPG,ON PG Turn-On timeCT = 0 pF105
CT = 1000 pF220
CT = 10000pF1230
tPG,OFF PG Turn-Off time0.8
tOFF Turn-Off time4.8
tF VOUT Fall timeCL = 0.1 µF, RL = 10 Ω2.1
VIN = 0.65 V
tON Turn-On timeCT = 0 pF54µs
CT = 1000 pF127
CT = 10000 pF720
tR VOUT Rise timeCT = 0 pF21
CT = 1000 pF61
CT = 10000 pF386
tPG,ON PG Turn-On timeCT = 0 pF165
CT = 1000 pF290
CT = 10000 pF1290
tPG,OFF PG Turn-Off time0.5
tOFF Turn-Off time55
tF VOUT Fall timeCL = 0.1 µF, RL = 10 Ω8
VIN = 1 V, TA = 0°C to 85°C
tON Fast Turn-On timeCT = 0 pF3065µs

Typical DC Characteristics

TPS22971 D001_SLVSDK7.gif
VON = 3.6 VIOUT = 0
Figure 1. Quiescent Current vs Temperature
TPS22971 D003_SLVSDK7.gif
VON = 3.6 VIOUT = -200 mA
Figure 3. On-Resistance vs Temperature
TPS22971 D002_SLVSDK7.gif
VON = 0 VVOUT = 0
Figure 2. Input Shutdown Current vs Temperature
TPS22971 D005_SLVSDK7.gif
VON = 3.6 VInitially VOUT = VIN
Figure 4. Output Pull-Down Resistance vs Temperature

Typical AC Characteristics

TPS22971 D007_SLVSDK7.gif Figure 5. Turn-On Time vs Temperature
TPS22971 D009_SLVSDK7.gif Figure 7. Rise Time vs Temperature
TPS22971 D013_SLVSDK7.gif Figure 9. PG Turn-Off Time vs Temperature
TPS22971 D010_SLVSDK7.gif
RL = 10 Ω CL = 0.1 μF
Figure 11. Fall Time vs Temperature
TPS22971 1p8_Rise.png
RL = 10 ΩCT = 0 pF
TA = 25°CCL = 0.1 µF
Figure 13. Turn-On Response at 1.8 VIN
TPS22971 3p6_Fall.png
RL = 10 ΩCT = 0 pF
TA = 25°CCL = 0.1 µF
Figure 15. Turn-Off Response at 3.6 VIN
TPS22971 0p65_Fall.png
RL = 10 ΩCIN = 0 pF
TA = 25°CCL = 0.1 µF
Figure 17. Turn-Off Response at 0.65 VIN
TPS22971 3p6_cout133_ct1000.png
CT = 1000 pFCL = 133 µF
RL = OPENTA = 25°C
Figure 19. High Inrush Current at 3.6 VIN
TPS22971 0p65_cout133_ct1000.png
CT = 1000 pFCL = 133 µF
RL = OPENTA = 25°C
Figure 21. High Inrush Current at 0.65 VIN
TPS22971 1p0_Fall_Cin10.png
CIN = 0 pFCL = 0.1 µF
RL = 10 ΩTA = 25°C
Figure 23. Fast Turn-Off Response
TPS22971 D006_SLVSDK7.gif
VIN = 1V CT = 0 pFCL = 0.1 µFRL = 10 Ω
Figure 6. Fast Turn-On Time vs Temperature
TPS22971 D012_SLVSDK7.gif Figure 8. PG Turn-On Time vs Temperature
TPS22971 D008_SLVSDK7.gif Figure 10. Turn-Off Time vs Temperature
TPS22971 3p6_Rise.png
RL = 10 ΩCT = 0 pF
TA = 25°CCL = 0.1 µF
Figure 12. Turn-On Response at 3.6 VIN
TPS22971 0p65_Rise.png
RL = 10 ΩCT = 0 pF
TA = 25°CCL = 0.1 µF
Figure 14. Turn-On Response at 0.65 VIN
TPS22971 1p8_Fall.png
RL = 10 ΩCT = 0 pF
TA = 25°CCL = 0.1 µF
Figure 16. Turn-Off Response at 1.8 VIN
TPS22971 3p6_cout33_ct1000.png
CT = 1000 pFCL = 33 µF
RL = OPENTA = 25°C
Figure 18. Low Inrush Current at 3.6 VIN
TPS22971 0p65_cout33_ct1000.png
CT = 1000 pFCL = 33 µF
RL = OPENTA = 25°C
Figure 20. Low Inrush Current at 0.65 VIN
TPS22971 1p0_Rise_Cin10.png
CT = 0 pFCL = 0.1 µF
RL = 10 ΩTA = 25°C
Figure 22. Fast Turn-On Response