ZHCSGK9B April   2017  – December 2017 TPS22971

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical DC Characteristics
    8. 6.8 Typical AC Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 On and Off Control
      2. 8.3.2 Controlled Turn-On
      3. 8.3.3 Power Good (PG)
      4. 8.3.4 Quick Output Discharge (QOD)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Thermal Consideration
      2. 9.1.2 PG Pull Up Resistor
      3. 9.1.3 Power Sequencing
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Maximum Voltage Drop and On-Resistance
        2. 9.2.2.2 Managing Inrush Current
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.1.1 Thermal Consideration

It is recommended to limit the junction temperature (TJ) to below 125°C. To calculate the maximum allowable dissipation, PD(max) for a given output current and ambient temperature, use Equation 6 as a guideline:

Equation 6. TPS22971 tps22971x-equation-06.gif

where

  • PD(max) is maximum allowable power dissipation
  • TJ(max) is maximum allowable junction temperature
  • TA is ambient temperature of the device
  • ΘJA is junction to air thermal impedance. See the Thermal Information section. This parameter is highly dependent upon board layout