ZHCSGF6A April   2017  – July 2017 TPD2S701-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings—AEC Specification
    3. 6.3  ESD Ratings—IEC Specification
    4. 6.4  ESD Ratings—ISO Specification
    5. 6.5  Recommended Operating Conditions
    6. 6.6  Thermal Information
    7. 6.7  Electrical Characteristics
    8. 6.8  Power Supply and Supply Current Consumption Chracteristics
    9. 6.9  Timing Requirements
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 OVP Operation
      2. 8.3.2 OVP Threshold
      3. 8.3.3 D± Clamping Voltage
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Device Operation
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 VREF Operation
          1. 9.2.2.1.1 Mode 0
          2. 9.2.2.1.2 Mode 1
        2. 9.2.2.2 Mode 1 Enable Timing
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 VPWR Path
    2. 10.2 VREF Pin
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Layout

11.1 Layout Guidelines

Proper routing and placement maintains signal integrity for high-speed signals. The following guidelines apply to the TPD2S701-Q1:

  • Place the bypass capacitors as close as possible to the VPWR and VREF pins. Capacitors must be attached to a solid ground. This minimizes voltage disturbances during transient events such as ESD or overcurrent conditions.
  • High speed traces (data switch path) must be routed as straight as possible and any sharp bends must be minimized.

Standard ESD recommendations apply to the VD+, VD- pins as well:

  • The optimum placement is as close to the connector as possible.
    • EMI during an ESD event can couple from the trace being struck to other nearby unprotected traces, resulting in early system failures.
    • The PCB designer must minimize the possibility of EMI coupling by keeping any unprotected traces away from the protected traces which are between the TVS and the connector.
  • Route the protected traces as straight as possible.
  • Eliminate any sharp corners on the protected traces between the TVS and the connector by using rounded corners with the largest radii possible.
    • Electric fields tend to build up on corners, increasing EMI coupling.

11.2 Layout Example

TPD2S701-Q1 TPD2S701_Q1_Layout.gif Figure 24. TPD2S701-Q1 Layout