ZHCSGS3 April   2017 TPD2S300

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings—JEDEC Specification
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 2-Channels of Short-to-VBUS Overvoltage Protection (CC1, CC2 Pins): 24-VDC Tolerant
      2. 7.3.2 2-Channels of IEC61000-4-2 ESD Protection (CC1, CC2 Pins)
      3. 7.3.3 Low Quiescent Current: 3.23 µA (Typical), VPWR, VM = 3.3 V
      4. 7.3.4 CC1, CC2 Overvoltage Protection FETs 200 mA Capable for Passing VCONN Power
      5. 7.3.5 CC Dead Battery Resistors Integrated for Handling Dead Battery Use Case in Mobile Devices
      6. 7.3.6 1.4-mm × 1.4-mm WCSP Package
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Smart-Phone Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 VBIAS Capacitor Selection
          2. 8.2.1.2.2 Dead Battery Operation
          3. 8.2.1.2.3 CC Line Capacitance
          4. 8.2.1.2.4 FLT Pin Operation
          5. 8.2.1.2.5 VCONN Operation
          6. 8.2.1.2.6 Low Quiescent Current
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Laptop Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 VBIAS Capacitor Selection
          2. 8.2.2.2.2 Dead Battery Operation
          3. 8.2.2.2.3 CC Line Capacitance
          4. 8.2.2.2.4 FLT Pin Operation
          5. 8.2.2.2.5 VCONN Operation
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Power Adaptor Application
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 VBIAS Capacitor Selection
          2. 8.2.3.2.2 Dead Battery Operation
          3. 8.2.3.2.3 CC Line Capacitance
          4. 8.2.3.2.4 FLT Pin Operation
          5. 8.2.3.2.5 VCONN Operation
        3. 8.2.3.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Configuration and Functions

YFF Package
9-Pin WCSP
Top Side Marking View
TPD2S300 Top_Side_Pinout.gif
YFF Package
9-Pin WCSP
Bottom, Bump View
TPD2S300 Bottom_bump_view.gif

Pin Functions

PIN TYPE DESCRIPTION
NO. NAME
A1 C_CC1 I/O Connector side of the CC1 OVP FET. Connect to either CC pin of the USB Type-C connector
A2 VBIAS Power Pin for ESD support capacitor. Place a 0.1-µF capacitor on this pin to ground
A3 C_CC2 I/O Connector side of the CC2 OVP FET. Connect to either CC pin of the USB Type-C connector
B1 CC1 I/O System side of the CC1 OVP FET. Connect to either CC pin of the CC/PD controller
B2 GND GND Ground
B3 CC2 I/O System side of the CC2 OVP FET. Connect to either CC pin of the CC/PD controller
C1 FLT O Open drain for fault reporting
C2 VPWR Power 2.7 V–4.5 V power supply
C3 VM I Voltage mode pin. Place 2.7 V–4.5 V on pin to operate for CC, PD, and FRS. Place 8.7 V–22 V on pin to operate the device in low resistance mode as well