ZHCSDT9C June 2015  – June 2015

PRODUCTION DATA. 

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Audio Characteristics (BTL)
    7. 7.7 Audio Characteristics (SE)
    8. 7.8 Audio Characteristics (PBTL)
    9. 7.9 Typical Characteristics, BTL Configuration
    10. 7.10Typical Characteristics, SE Configuration
    11. 7.11Typical Characteristics, PBTL Configuration
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1Overview
    2. 9.2Functional Block Diagrams
    3. 9.3Feature Description
      1. 9.3.1Error Reporting
    4. 9.4Device Protection System
      1. 9.4.1Overload and Short Circuit Current Protection
      2. 9.4.2DC Speaker Protection
      3. 9.4.3Pin-to-Pin Short Circuit Protection (PPSC)
      4. 9.4.4Overtemperature Protection OTW and OTE
      5. 9.4.5Undervoltage Protection (UVP) and Power-on Reset (POR)
      6. 9.4.6Fault Handling
      7. 9.4.7Device Reset
  10. 10Application and Implementation
    1. 10.1Application Information
    2. 10.2Typical Applications
      1. 10.2.1Stereo BTL Application
        1. 10.2.1.1Design Requirements
        2. 10.2.1.2Detailed Design Procedures
          1. 10.2.1.2.1Decoupling Capacitor Recommendations
          2. 10.2.1.2.2PVDD Capacitor Recommendation
          3. 10.2.1.2.3PCB Material Recommendation
          4. 10.2.1.2.4Oscillator
      2. 10.2.2Application Curves
      3. 10.2.3Typical Application, Single Ended (1N) SE
        1. 10.2.3.1Design Requirements
        2. 10.2.3.2Detailed Design Procedures
        3. 10.2.3.3Application Curves
      4. 10.2.4Typical Application, Differential (2N) PBTL
        1. 10.2.4.1Design Requirements
        2. 10.2.4.2Detailed Design Procedures
        3. 10.2.4.3Application Curves
  11. 11Power Supply Recommendations
    1. 11.1Power Supplies
      1. 11.1.1VDD Supply
    2. 11.2Powering Up
    3. 11.3Powering Down
  12. 12Layout
    1. 12.1Layout Guidelines
    2. 12.2Layout Examples
      1. 12.2.1BTL Application Printed Circuit Board Layout Example
      2. 12.2.2SE Application Printed Circuit Board Layout Example
      3. 12.2.3PBTL Application Printed Circuit Board Layout Example
  13. 13器件和文档支持
    1. 13.1文档支持
    2. 13.2社区资源
    3. 13.3商标
    4. 13.4静电放电警告
    5. 13.5Glossary
  14. 14机械、封装和可订购信息

4 修订历史记录

Changes from B Revision (June 2015) to C Revision

  • 已从单页“产品预览”更改为完整数据表Go

Changes from A Revision (June 2015) to B Revision

  • 已将特性列表项“80dB 电源抑制比 (PSRR)(BTL,无输入信号)”更改为“60dB 电源抑制比 (PSRR)(BTL,无输入信号)”Go
  • 已将特性列表项“>112dB(A 加权)信噪比 (SNR)”更改为“>111dB(A 加权)信噪比 (SNR)”Go

Changes from * Revision (May 2015) to A Revision

  • 已更改特性列表中的THD+N 为 1% 时的总输出功率Go
  • 已更改特性列表项“高级集成反馈设计...”Go
  • 已将特性列表项“<65µV(A 加权)输出噪声”更改为“<60µV(A 加权)输出噪声”Go
  • 已更改特性列表中的“多种可能配置:”Go
  • 已更改说明Go
  • 已添加简化电路原理图Go