ZHCSDT9C June 2015  – June 2015

PRODUCTION DATA. 

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Audio Characteristics (BTL)
    7. 7.7 Audio Characteristics (SE)
    8. 7.8 Audio Characteristics (PBTL)
    9. 7.9 Typical Characteristics, BTL Configuration
    10. 7.10Typical Characteristics, SE Configuration
    11. 7.11Typical Characteristics, PBTL Configuration
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1Overview
    2. 9.2Functional Block Diagrams
    3. 9.3Feature Description
      1. 9.3.1Error Reporting
    4. 9.4Device Protection System
      1. 9.4.1Overload and Short Circuit Current Protection
      2. 9.4.2DC Speaker Protection
      3. 9.4.3Pin-to-Pin Short Circuit Protection (PPSC)
      4. 9.4.4Overtemperature Protection OTW and OTE
      5. 9.4.5Undervoltage Protection (UVP) and Power-on Reset (POR)
      6. 9.4.6Fault Handling
      7. 9.4.7Device Reset
  10. 10Application and Implementation
    1. 10.1Application Information
    2. 10.2Typical Applications
      1. 10.2.1Stereo BTL Application
        1. 10.2.1.1Design Requirements
        2. 10.2.1.2Detailed Design Procedures
          1. 10.2.1.2.1Decoupling Capacitor Recommendations
          2. 10.2.1.2.2PVDD Capacitor Recommendation
          3. 10.2.1.2.3PCB Material Recommendation
          4. 10.2.1.2.4Oscillator
      2. 10.2.2Application Curves
      3. 10.2.3Typical Application, Single Ended (1N) SE
        1. 10.2.3.1Design Requirements
        2. 10.2.3.2Detailed Design Procedures
        3. 10.2.3.3Application Curves
      4. 10.2.4Typical Application, Differential (2N) PBTL
        1. 10.2.4.1Design Requirements
        2. 10.2.4.2Detailed Design Procedures
        3. 10.2.4.3Application Curves
  11. 11Power Supply Recommendations
    1. 11.1Power Supplies
      1. 11.1.1VDD Supply
    2. 11.2Powering Up
    3. 11.3Powering Down
  12. 12Layout
    1. 12.1Layout Guidelines
    2. 12.2Layout Examples
      1. 12.2.1BTL Application Printed Circuit Board Layout Example
      2. 12.2.2SE Application Printed Circuit Board Layout Example
      3. 12.2.3PBTL Application Printed Circuit Board Layout Example
  13. 13器件和文档支持
    1. 13.1文档支持
    2. 13.2社区资源
    3. 13.3商标
    4. 13.4静电放电警告
    5. 13.5Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
订购信息

13 器件和文档支持

13.1 文档支持

《TPA3251D2EVM 用户指南》SLVUAG8

13.2 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.3 商标

PurePath, E2E are trademarks of Texas Instruments.

蓝光碟磁盘 is a trademark of Blu-ray Disc Association.

All other trademarks are the property of their respective owners.

13.4 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损伤。

13.5 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.