ZHCSFQ5A April   2016  – November 2016 TPA3244

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Audio Characteristics (BTL)
    7. 7.7 Audio Characteristics (SE)
    8. 7.8 Audio Characteristics (PBTL)
    9. 7.9 Typical Characteristics
      1. 7.9.1 BTL Configuration
      2. 7.9.2 SE Configuration
      3. 7.9.3 PBTL Configuration
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 Error Reporting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Protection System
        1. 9.4.1.1 Overload and Short Circuit Current Protection
        2. 9.4.1.2 Signal Clipping and Pulse Injector
        3. 9.4.1.3 DC Speaker Protection
        4. 9.4.1.4 Pin-to-Pin Short Circuit Protection (PPSC)
        5. 9.4.1.5 Overtemperature Protection OTW and OTE
        6. 9.4.1.6 Undervoltage Protection (UVP) and Power-on Reset (POR)
        7. 9.4.1.7 Fault Handling
        8. 9.4.1.8 Device Reset
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Stereo BTL Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedures
          1. 10.2.1.2.1 Decoupling Capacitor Recommendations
          2. 10.2.1.2.2 PVDD Capacitor Recommendation
          3. 10.2.1.2.3 PCB Material Recommendation
          4. 10.2.1.2.4 Oscillator
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Typical Application, Single Ended (1N) SE
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Application Curves
      3. 10.2.3 Typical Application, Differential (2N), PBTL (Outputs Paralleled before LC filter)
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Application Curves
    3. 10.3 Typical Application, Differential (2N), PBTL (Outputs Paralleled after LC filter)
      1. 10.3.1 Design Requirements
      2. 10.3.2 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power Supplies
      1. 11.1.1 VDD Supply
      2. 11.1.2 GVDD_X Supply
      3. 11.1.3 PVDD Supply
    2. 11.2 Powering Up
    3. 11.3 Powering Down
    4. 11.4 Thermal Design
      1. 11.4.1 Thermal Performance
      2. 11.4.2 Thermal Performance with Continuous Output Power
      3. 11.4.3 Thermal Performance with Non-Continuous Output Power
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
      1. 12.2.1 BTL Application Printed Circuit Board Layout Example
      2. 12.2.2 SE Application Printed Circuit Board Layout Example
      3. 12.2.3 PBTL (Outputs Paralleled before LC filter) Application Printed Circuit Board Layout Example
      4. 12.2.4 PBTL (Outputs Paralleled after LC filter) Application Printed Circuit Board Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
    2. 13.2 接收文档更新通知
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 Glossary
  14. 14机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DDW|44
散热焊盘机械数据 (封装 | 引脚)
订购信息

Power Supply Recommendations

Power Supplies

The TPA3244 device requires two external power supplies for proper operation. A high-voltage supply called PVDD is required to power the output stage of the speaker amplifier and its associated circuitry. Additionally, one mid-voltage power supply for GVDD_X and VDD is required to power the gate-drive and other internal digital and analog portions of the device. The allowable voltage range for both the PVDD and the GVDD_X/VDD supplies are listed in the Recommended Operating Conditions table. Ensure both the PVDD and the GVDD_X/VDD supplies can deliver more current than listed in the Electrical Characteristics table.

VDD Supply

The VDD supply required from the system is used to power several portions of the device. It provides power to internal regulators DVDD and AVDD that are used to power digital and analog sections of the device, respectively. Proper connection, routing, and decoupling techniques are highlighted in the TPA3244 Evaluation Module User's Guide (SLVUAT5) (as well as the Application Information section and Layout Examples section) and must be followed as closely as possible for proper operation and performance. Deviation from the guidance offered in the TPA3244 Evaluation Module User's Guide (SLVUAT5), which followed the same techniques as those shown in the Application Information section, may result in reduced performance, errant functionality, or even damage to the TPA3244 device. Some portions of the device also require a separate power supply which is a lower voltage than the VDD supply. To simplify the power supply requirements for the system, the TPA3244 device includes integrated low-dropout (LDO) linear regulators to create these supplies. These linear regulators are internally connected to the VDD supply and their outputs are presented on AVDD and DVDD pins, providing a connection point for an external bypass capacitors. It is important to note that the linear regulators integrated in the device have only been designed to support the current requirements of the internal circuitry, and should not be used to power any additional external circuitry. Additional loading on these pins could cause the voltage to sag and increase noise injection, which negatively affects the performance and operation of the device.

GVDD_X Supply

The GVDD_X supply required from the system is used to power the gate-drives for the output H-bridges. Proper connection, routing, and decoupling techniques are highlighted in the TPA3244 Evaluation Module User's Guide (SLVUAT5) (as well as the Application Information section and Layout Examples section) and must be followed as closely as possible for proper operation and performance. Deviation from the guidance offered in the TPA3244 device EVM User's Guide, which followed the same techniques as those shown in the Application Information section, may result in reduced performance, errant functionality, or even damage to the TPA3244 device.

PVDD Supply

The output stage of the amplifier drives the load using the PVDD supply. This is the power supply which provides the drive current to the load during playback. Proper connection, routing, and decoupling techniques are highlighted in the TPA3244 Evaluation Module User's Guide (SLVUAT5) (as well as the Application Information section and Layout Examples section) and must be followed as closely as possible for proper operation and performance. Due the high-voltage switching of the output stage, it is particularly important to properly decouple the output power stages in the manner described in the TPA3244 Evaluation Module User's Guide (SLVUAT5). The lack of proper decoupling, like that shown in the EVM User's Guide, can results in voltage spikes which can damage the device, or cause poor audio performance and device shutdown faults.

Powering Up

The TPA3244 device does not require a power-up sequence, but it is recommended to hold RESET low for at least 250 ms after PVDD supply voltage is turned ON. The outputs of the H-bridges remain in a high-impedance state until the gate-drive supply voltage (GVDD_X) and VDD voltages are above the undervoltage protection (UVP) voltage threshold (see the Electrical Characteristics table of this data sheet). This allows an internal circuit to charge the external bootstrap capacitors by enabling a weak pulldown of the half-bridge output as well as initiating a controlled ramp up sequence of the output voltage.

TPA3244 StartupTiming.gif Figure 27. Startup Timing

When RESET is released to turn on the TPA3244 device, FAULT signal will turn low and AVDD voltage regulator will be enabled. FAULT will stay low until AVDD reaches the undervoltage protection (UVP) voltage threshold (see the Electrical Characteristics table of this data sheet). After a precharge time to stabilize the DC voltage across the input AC coupling capacitors, before the ramp up sequence starts.

Powering Down

The TPA3244 device does not require a power-down sequence. The device remains fully operational as long as the gate-drive supply (GVDD_X) voltage and VDD voltage are above the undervoltage protection (UVP) voltage threshold. Although not specifically required, it is a good practice to hold RESET low during power down, thus preventing audible artifacts including pops or clicks by initiating a controlled ramp down sequence of the output voltage.

Thermal Design

Thermal Performance

The TPA3244 device thermal performance is dependent on the thermal design of the PCB. As a result, the maximum continuous output power attainable will be influenced by the PCB design. The continuous power rating is lower than the peak output power capability of the device. The peak power rating of the TPA3244 deviceis based on the burst capability of the device. The peak to average power ratio of the TPA3244 device is well suited to handle even demanding audio playback without thermal shutdown. Thermal performance with typical audio content (burst) versus sine wave content (continuous) should be considered when defining the thermal test requirements for the end product.

Thermal Performance with Continuous Output Power

It is recommended to operate the TPA3244 device below the OTW threshold, which in most systems will require the average output power to be below the maximum peak output power. The maximum continuous power, the TPA3244 device will deliver depends directly on the thermal design of the PCB and for the entire system (closed box with no air flow, or a fanned system etc.). Thermal performance is also impacted by PVDD voltage and switching frequency. The best configuration for a given application will often depend on the continuous output power requirements.

Table 15. Device and PCB Temperatures with 8-Ω Load, TA = 40°C

TA = 40°C, TPA3244 EVM, No Airflow. Steady State Temperatures.
PVDD Switching Frequency Continuous Power [W] Device Top Temperature Maximum PCB Temperature Comment
30V 450kHz 63W 10% THD 128ºC 93ºC OTW after 187 seconds.
30V 450kHz 31.5W 1/2 of 10% THD power 111ºC 83ºC
30V 450kHz 15.75W 1/4 of 10% THD power 89ºC 71ºC
30V 450kHz 7.9W 1/8 of 10% THD power 76ºC 63ºC
30V 600kHz 62W 10% THD 141ºC 100ºC OTW after 38 seconds. Not recommended.
30V 600kHz 31W 1/2 of 10% THD power 130ºC 94ºC OTW after 205 seconds.
30V 600kHz 15.5W 1/4 of 10% THD power 99ºC 77ºC
30V 600kHz 7.75W 1/8 of 10% THD power 84ºC 68ºC

Table 16. Device and PCB Temperatures with 4-Ω Load, TA = 40°C

TA = 40°C, TPA3244 EVM, No Airflow. Steady State Temperatures.
PVDD Switching Frequency Continuous Power [W] Device Top Temperature Maximum PCB Temperature Comment
30V 450kHz 114W 10% THD OTE(1) OTW and OTE after less than 1 second. Not recommended.
30V 450kHz 57W 1/2 of 10% THD power OTE(1) OTW after 3 seconds and OTE after 9 seconds. Not recommended.
30V 450kHz 28.5W 1/4 of 10% THD power OTE(1) OTW after 44 seconds and OTE after 327 seconds. Not recommended.
30V 450kHz 14.25W 1/8 of 10% THD power 107ºC 82ºC
30V 600kHz Not recommended
26V 450kHz 84W 10% THD OTE(1) OTW after 3 seconds and OTE after 6 seconds. Not recommended.
26V 450kHz 42W 1/2 of 10% THD power OTE(1) OTW after 15 seconds and OTE after 56 seconds. Not recommended.
26V 450kHz 21W 1/4 of 10% THD power 113ºC 84ºC
26V 450kHz 10.5W 1/8 of 10% THD power 87ºC 69ºC
26V 600kHz 83W 10% THD OTE(1) OTW after 3 seconds and OTE after 6 seconds. Not recommended.
26V 600kHz 41.5W 1/2 of 10% THD power OTE(1) OTW after 9 seconds and OTE after 30 seconds. Not recommended.
26V 600kHz 20.75W 1/4 of 10% THD power 129ºC 93ºC OTW after 301 seconds.
30V 600kHz 10.50W 1/8 of 10% THD power 97ºC 76ºC
Steady state data is not available because device heats up to OTE in this condition.

Thermal Performance with Non-Continuous Output Power

As audio signals often have a peak to average ratio larger than one (average level below maximum peak output), the thermal performance for audio signals can be illustrated using burst signals with different burst ratios.

TPA3244 MusicExample.gif Figure 28. Example of audio signal

A burst signal is characterized by the high-level to low-level ratio as well as the duration of the high level and low level, e.g. a burst 1:4 stimuli is a single period of high level followed by 4 cycles of low level.

TPA3244 Burst.gif Figure 29. Example of 1:4 Burst Signal

The following analysis of thermal performance for the TPA3244 device is made with the TPA3244 EVM surrounded by still air (no airflow) with a controlled air temperature of 40°C. For 30 V operation the system is not thermally limited with 8Ω load, but depending on the burst stimuli for operation at 30V some thermal limitations may occur, depending on switching frequency and average to maximum power ratio. Low to maximum power ratio of the burst stimuli is given in the plots as for example P1:8 which equals low level burst cycles of 1/8 power of the high level cycles. The level of the high power cycles is set equal to 10% THD level.

TPA3244 D032_SLASEC6.gif
PVDD = 30 V, fs = 450kHz RL = 8Ω TA = 40°C
Figure 30. Device and PCB Temperatures vs. Burst Ratio
TPA3244 D034_SLASEC6.gif
PVDD = 26 V, fs = 450kHz RL = 4Ω TA = 40°C
Figure 32. Device and PCB Temperatures vs. Burst Ratio
TPA3244 D033_SLASEC6.gif
PVDD = 30 V, fs = 600kHz RL = 8Ω TA = 40°C
Figure 31. Device and PCB Temperatures vs. Burst Ratio
TPA3244 D035_SLASEC6.gif
PVDD = 26 V, fs = 600kHz RL = 4Ω TA = 40°C
Figure 33. Device and PCB Temperatures vs. Burst Ratio