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TPA311

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支持从桥接式负载切换至单端开关模式的 350mW、单声道 AB 类音频放大器

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TPA311

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产品详情

Speaker channels (max) Mono Rating Catalog Load (min) (Ω) 8 Output power (W) 0.35 THD + N at 1 kHz (%) 1 Iq (typ) (mA) 0.7 Control interface Hardware Analog supply (min) (V) 2.7 Analog supply voltage (max) (V) 5.5 PSRR (dB) 85 Operating temperature range (°C) to
Speaker channels (max) Mono Rating Catalog Load (min) (Ω) 8 Output power (W) 0.35 THD + N at 1 kHz (%) 1 Iq (typ) (mA) 0.7 Control interface Hardware Analog supply (min) (V) 2.7 Analog supply voltage (max) (V) 5.5 PSRR (dB) 85 Operating temperature range (°C) to
HVSSOP (DGN) 8 14.7 mm² 3 x 4.9 SOIC (D) 8 29.4 mm² 4.9 x 6
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 5 V, SE
    • 250 mW at VDD = 3.3 V, BTL
    • 75 mW at VDD = 3.3 V, SE
  • Shutdown Control
    • IDD = 7 µA at 3.3 V
    • IDD = 60 µA at 5 V
  • BTL to SE Mode Control
  • Integrated Depop Circuitry
  • Thermal and Short-Circuit Protection
  • Surface Mount Packaging
    • SOIC
    • PowerPADTM MSOP

PowerPAD is a trademark of Texas Instruments Incorporated.
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 5 V, SE
    • 250 mW at VDD = 3.3 V, BTL
    • 75 mW at VDD = 3.3 V, SE
  • Shutdown Control
    • IDD = 7 µA at 3.3 V
    • IDD = 60 µA at 5 V
  • BTL to SE Mode Control
  • Integrated Depop Circuitry
  • Thermal and Short-Circuit Protection
  • Surface Mount Packaging
    • SOIC
    • PowerPADTM MSOP

PowerPAD is a trademark of Texas Instruments Incorporated.

The TPA311 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA311 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA311 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

The TPA311 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA311 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA311 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
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TPA301 正在供货 350mW 单声道 AB 类音频放大器 Ultra-low quiescent current in shutdown mode (0.15 µA)

技术文档

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类型 标题 下载最新的英语版本 日期
* 数据表 350-mW Low-Voltage Audio Power Amplifier 数据表 (Rev. C) 2003年 5月 2日
应用手册 PowerPAD™ Thermally Enhanced Package (Rev. H) 2018年 7月 6日
EVM 用户指南 TPA311EVM - User Guide (Rev. A) 2001年 4月 17日
用户指南 TPA311MSOPEVM - User Guide (Rev. A) 2001年 4月 17日

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