产品详情

Audio input type Analog Input Architecture Class-D Speaker channels (max) Stereo Rating Catalog Power stage supply (max) (V) 18 Power stage supply (min) (V) 8.5 Load (min) (Ω) 4 THD + N at 1 kHz (%) 0.2 Iq (typ) (mA) 16 Control interface Hardware Closed/open loop Open Analog supply (min) (V) 8.5 Analog supply voltage (max) (V) 18 PSRR (dB) 80 Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-D Speaker channels (max) Stereo Rating Catalog Power stage supply (max) (V) 18 Power stage supply (min) (V) 8.5 Load (min) (Ω) 4 THD + N at 1 kHz (%) 0.2 Iq (typ) (mA) 16 Control interface Hardware Closed/open loop Open Analog supply (min) (V) 8.5 Analog supply voltage (max) (V) 18 PSRR (dB) 80 Operating temperature range (°C) -40 to 85
HTQFP (PHP) 48 81 mm² 9 x 9
  • 12-W/Ch Into an 8- Load From 15-V Supply
  • Efficient, Class-D Operation Eliminates Heatsinks and Reduces Power Supply Requirements
  • 32-Step DC Volume Control From –40 dB to 36 dB
  • Line Outputs For External Headphone Amplifier With Volume Control
  • Regulated 5-V Supply Output for Powering TPA6110A2
  • Space-Saving, Thermally-Enhanced PowerPAD™ Packaging
  • Thermal and Short-Circuit Protection
  • APPLICATIONS
    • LCD Monitors and TVs
    • Powered Speakers
    • >

PowerPAD is a trademark of Texas Instruments.

  • 12-W/Ch Into an 8- Load From 15-V Supply
  • Efficient, Class-D Operation Eliminates Heatsinks and Reduces Power Supply Requirements
  • 32-Step DC Volume Control From –40 dB to 36 dB
  • Line Outputs For External Headphone Amplifier With Volume Control
  • Regulated 5-V Supply Output for Powering TPA6110A2
  • Space-Saving, Thermally-Enhanced PowerPAD™ Packaging
  • Thermal and Short-Circuit Protection
  • APPLICATIONS
    • LCD Monitors and TVs
    • Powered Speakers
    • >

PowerPAD is a trademark of Texas Instruments.

The TPA3004D2 is a 12-W (per channel) efficient, Class-D audio amplifier for driving bridged-tied stereo speakers. The TPA3004D2 can drive stereo speakers as low as 4 . The high efficiency of the TPA3004D2 eliminates the need for external heatsinks when playing music.

Stereo speaker volume is controlled with a dc voltage applied to the volume control terminal offering a range of gain from –40 dB to 36 dB. Line outputs, for driving external headphone amplifier inputs, are also dc voltage controlled with a range of gain from –56 dB to 20 dB.

An integrated 5-V regulated supply is provided for powering an external headphone amplifier.

The TPA3004D2 is a 12-W (per channel) efficient, Class-D audio amplifier for driving bridged-tied stereo speakers. The TPA3004D2 can drive stereo speakers as low as 4 . The high efficiency of the TPA3004D2 eliminates the need for external heatsinks when playing music.

Stereo speaker volume is controlled with a dc voltage applied to the volume control terminal offering a range of gain from –40 dB to 36 dB. Line outputs, for driving external headphone amplifier inputs, are also dc voltage controlled with a range of gain from –56 dB to 20 dB.

An integrated 5-V regulated supply is provided for powering an external headphone amplifier.

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新一代 15W、立体声、模拟输入 D 类音频放大器:TPA3110D2

新一代低 EMI 10W、立体声、模拟输入 D 类音频放大器:TPA3136D2

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类型 标题 下载最新的英语版本 日期
* 数据表 12W Stereo Class-D Audio Power Amp w/DC Volume Control 数据表 (Rev. E) 2010年 1月 10日
应用手册 Layout Guidelines For TPA300x Series Parts (Rev. A) 2020年 6月 24日
应用手册 Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) 2019年 8月 26日
应用手册 AN-1849 An Audio Amplifier Power Supply Design (Rev. C) 2019年 6月 27日
应用手册 AN-1737 Managing EMI in Class D Audio Applications (Rev. A) 2013年 5月 1日
应用手册 RC Filter Box For Class-D Output Power and THD+N Measurement 2004年 2月 20日
EVM 用户指南 TPA3004D2EVM - User Guide (Rev. A) 2003年 5月 15日

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参考设计

TIDA-01182 — 具有自动音频控制 1S1P BMS 的便携式音频放大器参考设计

高性能 10W(每个扬声器 5W)便携式音频放大器,包括为 D 类音频放大器中的便携式音频放大器实施 BMS(电池管理解决方案)所需的一切(包括用于 1S1P 18650 2400mAh 锂电池的充电器、电量监测计和保护装置)。通过使用高效电源稳压器、D 类放大器和适当的电池管理,获得更长的运行时间。
设计指南: PDF
原理图: PDF
封装 引脚 下载
HTQFP (PHP) 48 查看选项

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  • 引脚镀层/焊球材料
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  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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  • 封装厂地点

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