TPA3002D2
- 9-W/Ch Into an 8- Load From 12-V Supply
- Efficient, Class-D Operation Eliminates Heatsinks and Reduces Power Supply Requirements
- 32-Step DC Volume Control From –40 dB to 36 dB
- Line Outputs For External Headphone Amplifier With Volume Control
- Regulated 5-V Supply Output for Powering TPA6110A2
- Space-Saving, Thermally-Enhanced PowerPAD™ Packaging
- Thermal and Short-Circuit Protection
- APPLICATIONS
- LCD Monitors and TVs
- Powered Speakers
PowerPAD is a trademark of Texas Instruments.
The TPA3002D2 is a 9-W (per channel) efficient, Class-D audio amplifier for driving bridged-tied stereo speakers. The TPA3002D2 can drive stereo speakers as low as 8 . The high efficiency of the TPA3002D2 eliminates the need for external heatsinks when playing music.
Stereo speaker volume is controlled with a dc voltage applied to the volume control terminal offering a range of gain from 40 dB to 36 dB. Line outputs, for driving external headphone amplifier inputs, are also dc voltage controlled with a range of gain from 56 dB to 20 dB.
An integrated 5-V regulated supply is provided for powering an external headphone amplifier.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | 9-W Stereo Class-D Audio Power Amplifier w/DC Volume Control 数据表 (Rev. C) | 2004年 3月 28日 | |||
应用手册 | Layout Guidelines For TPA300x Series Parts (Rev. A) | 2020年 6月 24日 | ||||
应用手册 | RC Filter Box For Class-D Output Power and THD+N Measurement | 2004年 2月 20日 | ||||
EVM 用户指南 | TPA3002D2EVM - User Guide | 2002年 12月 13日 |
设计和开发
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TPA3002D2EVM — TPA3002D2 评估模块 (EVM)
The TPA3002D2 is a 9-W (per channel) highly efficient Class-D stereo audio power amplifier designed for driving 8-Ohm bridged-tied speakers. The high efficiency of the TPA3002D2 eliminates the need for external heat sinks when playing music and helps maximizes battery life.
Stereo speaker volume is (...)
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封装 | 引脚 | 下载 |
---|---|---|
HTQFP (PHP) | 48 | 查看选项 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
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