TPA3001D1
- 20 W Into 8- Load From 18-V Supply (10% THD+N)
- Short-Circuit Protection (Short to VCC, Short to GND,
Short Between Outputs) - Third-Generation Modulation Technique:
- Replaces Large LC Filter With Small, Low-Cost Ferrite
Bead Filter in Most Applications - Improved Efficiency
- Improved SNR
- Replaces Large LC Filter With Small, Low-Cost Ferrite
- Low Supply Current: 8 mA Typ at 12 V
- Shutdown Control: < 1 µA Typ
- Space-Saving, Thermally-Enhanced PowerPAD™ Packaging
- APPLICATIONS
- LCD Monitors/TVs
- Hands-Free Car Kits
- Powered Speakers
PowerPAD Is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners
The TPA3001D1 (sometimes referred to as TPA3001) is a 20-W monaural bridge-tied load (BTL) class-D audio power amplifier (class-D amp) with high efficiency, eliminating the need for heat sinks. The TPA3001D1 can drive 4- or 8- speakers with only a ferrite bead filter required to reduce EMI.
The gain of the amplifier is controlled by two input terminals, GAIN1 and GAIN0. This allows the amplifier to be configured for a gain of 12, 18, 23.6, or 36 dB. The differential input stage provides high common-mode rejection and improved power-supply rejection.
The amplifier also includes depop circuitry to reduce the amount of pop at power-up and when cycling SHUTDOWN.
The TPA3001D1 (TPA3001) is available in the 24-pin thermally enhanced TSSOP package (PWP), which eliminates the need for an external heat sink.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | 20W Mono Class-D Audio Power Amplifier 数据表 (Rev. E) | 2010年 8月 23日 | |||
应用手册 | Layout Guidelines For TPA300x Series Parts (Rev. A) | 2020年 6月 24日 | ||||
应用手册 | Using Thermal Calculation Tools for Analog Components (Rev. A) | 2019年 8月 30日 | ||||
应用手册 | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019年 8月 26日 | ||||
应用手册 | AN-1849 An Audio Amplifier Power Supply Design (Rev. C) | 2019年 6月 27日 | ||||
应用手册 | AN-1737 Managing EMI in Class D Audio Applications (Rev. A) | 2013年 5月 1日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®
借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。
在 PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
封装 | 引脚 | 下载 |
---|---|---|
HTSSOP (PWP) | 24 | 查看选项 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点