TMS320C6474 多核数字信号处理器 | 德州仪器 TI.com.cn

TMS320C6474
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多核数字信号处理器

多核数字信号处理器 - TMS320C6474
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No design support from TI available

This product does not have ongoing design support from TI for new projects, such as new content or software updates. If available, you will find relevant collateral, software and tools in the product folder. You can also search for archived information in the TI E2ETM support forums.

描述

The TMS320C64x+ DSPs (including the TMS320C6474 device) are the highest-performance multicore DSP generation in the TMS320C6000™ DSP platform.

The C6474 device is based on the third-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI).

The C64x+™ devices are upward code-compatible from previous devices that are part of the C6000™ DSP platform.

特性

  • Key Features
    • High-Performance Multicore DSP (C6474)
    • Instruction Cycle Time: 0.83 ns (1.2-GHz Device); 1 ns (1-GHz Device); 1.18 ns (850-MHz Device)
    • Clock Rate: 1 GHz to 1.2 GHz (1.2-GHz Device); 1 GHz (1-GHz Device); 850 MHz (850-MHz Device)
    • Commercial Temperature and Extended Tmperature
    • 3 TMS320C64x+™ DSP Cores; Six RSAs for CDMA Processing (2 per core)
    • Enhanced VCP2/TCP2
    • Frame Synchronization Interface
    • 16-/32-Bit DDR2-667 Memory Controller
    • EDMA3 Controller
    • Antenna Interface
    • Two 1x Serial RapidIO® Links, v1.2 Compliant
    • One 1.8-V Inter-Integrated Circuit (I2C) Bus
    • Two 1.8-V McBSPs
    • 1000 Mbps Ethernet MAC (EMAC)
    • Six 64-Bit General-Purpose Timers
    • 16 General-Purpose I/O (GPIO) Pins
    • Internal Semaphore Module non-UMTS Systems
    • System PLL and PLL Controller/DDR PLL and PLL Controller, Dedicated to DDR2 Memory Controller
  • High-Performance Multicore DSP (C6474)
    • Instruction Cycle Time:
      • 1.2-GHz Device: 1.0-ns to 0.83-ns
      • 1-GHz Device: 1-ns
      • 850-MHz Device: 1.18 ns
    • Clock Rate:
      • 1.2-GHz Device: 1-GHz to 1.2-GHz
      • 1-GHz Device: 1-GHz
      • 850-MHz Device: 850 MHz
    • Eight 32-Bit Instructions/Cycle
    • Commercial Temperature:
      • 1.2-GHz Device: 0°C to 95°C
      • 1-GHz Device: 0°C to 100°C
      • 850-MHZ and 1-GHz Device: 0°C to 100°C
    • Extended Temperature:
      • 1.2-GHz Device: -40°C to 95°C(1)
      • 1-GHz Device: -40°C to 100°C
  • 3 TMS320C64x+™ DSP Cores
    • Dedicated SPLOOP Instructions
    • Compact Instructions (16-Bit)
    • Exception Handling
  • TMS320C64x+ Megamodule L1/L2 Memory Architecture
    • 256 K-Bit (32 K-Byte) L1P Program Cache [Direct Mapped]
    • 256 K-Bit (32 K-Byte) L1D Data Cache [2-Way Set-Associative]
    • 512 K-Bit (64 K-Byte) L3 ROM
  • Enhanced VCP2
    • Supports Over 694 7.95-Kbps AMR
  • Enhanced Turbo Decoder Coprocessor (TCP2)
    • Supports up to Eight 2-Mbps 3 GPP (6 Iterations)
  • Endianness: Little Endian, Big Endian
  • Frame Synchronization Interface
    • Time Alignment Between Internal Subsystems, External Devices/System
    • OBSAI RP1 Compliant for Frame Burst Data
    • Alternate Interfaces for non-RP1 and non-UMTS Systems
  • 16-/32-Bit DDR2-667 Memory Controller
  • EDMA3 Controller (64 Independent Channels)
  • Antenna Interface
    • 6 Configurable Links (Full Duplex)
    • Supports OBSAI RP3 Protocol, v1.0: 768-Mbps, 1.536-, 3.072-Gbps Link Rates
    • Supports CPRI Protocol V2.0:614.4-Mbps, 1.2288-, 2.4576-Gbps Link Rates
    • Clock Input Independent or Shared with CPU (Selectable at Boot-Time)
  • Two 1x Serial RapidIO® Links, v1.2 Compliant
    • 1.25-, 2.5-, 3.125-Gbps Link Rates
    • Message Passing and DirectIO Support
    • Error Management Extensions and Congestion Control
  • One 1.8-V Inter-Integrated Circuit (I2C) Bus
  • Two 1.8-V McBSPs
  • 1000 Mbps Ethernet MAC (EMAC)
    • IEEE 802.3 Compliant
    • Supports SGMII, v1.8 Compliant
    • 8 Independent Transmit (TX) and 8 Independent Receive (RX) Channels
  • Six 64-Bit General-Purpose Timers
    • Configurable up to Twelve 32-Bit Timers
    • Configurable in a Watchdog Timer mode
  • 16 General-Purpose I/O (GPIO) Pins
  • Internal Semaphore Module
    • Software Method to Control Access to Shared Resources
    • 32 General Purpose Semaphore Resources
  • System PLL and PLL Controller
  • DDR PLL and PLL Controller, Dedicated to DDR2 Memory Controller
  • IEEE-1149.1 and IEEE-1149.6 (JTAG™) Boundary-Scan-Compatible
  • 561-Pin Ball Grid Array (BGA) Packages (CUN, GUN, or ZUN Suffix), 0.8-mm Ball Pitch
  • 0.065-µm/7-Level Cu Metal Process (CMOS)
  • SmartReflex™ Class 0 Enabled - 0.9-V to 1.2-V Adaptive Core Voltage
  • 1.8-V, 1.1-V I/Os

(1)Note: Advance Information is presented in this document for the C6474 1.2-GHz extended temperature device.

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参数

与其它产品相比 C6000 浮点 DSP 邮件 下载到电子表格中
Part number 立即下单 DSP On-chip L2 cache/RAM Total on-chip memory (KB) Operating systems DRAM Ethernet MAC Serial I/O I2C Approx. price (US$) Operating temperature range (C) Rating
TMS320C6474 立即下单 3 C64x+     3072 KB     3200     DSP/BIOS     DDR2
SDRAM    
10/100/1000     I2C
RapidIO
McBSP    
1     164.22 | 1ku     -40 to 100
-40 to 95
0 to 85    
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