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TLE2426-EP

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TLE2426-EP

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产品详情

Iout (typ) (A) 0.047 Vs (min) (V) 4 Vs (max) (V) 40 Operating temperature range (°C) -55 to 125 Rating HiRel Enhanced Product
Iout (typ) (A) 0.047 Vs (min) (V) 4 Vs (max) (V) 40 Operating temperature range (°C) -55 to 125 Rating HiRel Enhanced Product
SOIC (D) 8 29.4 mm² 4.9 x 6
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • One-Half VI Virtual Ground for Analog Systems
  • Micropower Operation . . . 170 µA Typ, VI = 5 V
  • Wide VI Range . . . 4 V to 40 V
  • High Output-Current Capability
    • Source . . . 20 mA Typ
    • Sink . . . 20 mA Typ
  • Excellent Output Regulation
    • -102 µV Typ at IO = 0 mA to -10 mA
    • 49 µV Typ at IO = 0 mA to 10 mA
  • Low-Impedance Output . . . 0.0075 Typ
  • Noise Reduction Pin

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • One-Half VI Virtual Ground for Analog Systems
  • Micropower Operation . . . 170 µA Typ, VI = 5 V
  • Wide VI Range . . . 4 V to 40 V
  • High Output-Current Capability
    • Source . . . 20 mA Typ
    • Sink . . . 20 mA Typ
  • Excellent Output Regulation
    • -102 µV Typ at IO = 0 mA to -10 mA
    • 49 µV Typ at IO = 0 mA to 10 mA
  • Low-Impedance Output . . . 0.0075 Typ
  • Noise Reduction Pin

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

In signal-conditioning applications utilizing single power source, a reference voltage equal to one-half the supply voltage is required for termination of all analog signal grounds. TI presents a precision virtual ground whose output voltage is always equal to one-half the input voltage—the TLE2426 rail splitter.

The unique combination of a high-performance, micropower operational amplifier and a precisiontrimmed divider on a single silicon chip results in a precise VO/VI ratio of 0.5 while sinking and sourcing current. The TLE2426 provides a lowimpedance output with 20 mA of sink and source capability, while drawing less than 280 µA of supply current over the full input range of 4 V to 40 V. A designer need not pay the price in terms of board space for a conventional signal ground consisting of resistors, capacitors, operational amplifiers, and voltage references. For increased performance, the 8-pin package provides noise-reduction pin. With the addition of an external capacitor (CNR), peak-to-peak noise is reduced, while line ripple rejection is improved.

Initial output tolerance for a single 5-V or 12-V system is better than 1% over the full 40-V input range. Ripple rejection exceeds 12 bits of accuracy. Whether the application is for a data-acquisition front end, analog signal termination, or simply a precision voltage reference, the TLE2426 eliminates a major source of system error.

In signal-conditioning applications utilizing single power source, a reference voltage equal to one-half the supply voltage is required for termination of all analog signal grounds. TI presents a precision virtual ground whose output voltage is always equal to one-half the input voltage—the TLE2426 rail splitter.

The unique combination of a high-performance, micropower operational amplifier and a precisiontrimmed divider on a single silicon chip results in a precise VO/VI ratio of 0.5 while sinking and sourcing current. The TLE2426 provides a lowimpedance output with 20 mA of sink and source capability, while drawing less than 280 µA of supply current over the full input range of 4 V to 40 V. A designer need not pay the price in terms of board space for a conventional signal ground consisting of resistors, capacitors, operational amplifiers, and voltage references. For increased performance, the 8-pin package provides noise-reduction pin. With the addition of an external capacitor (CNR), peak-to-peak noise is reduced, while line ripple rejection is improved.

Initial output tolerance for a single 5-V or 12-V system is better than 1% over the full 40-V input range. Ripple rejection exceeds 12 bits of accuracy. Whether the application is for a data-acquisition front end, analog signal termination, or simply a precision voltage reference, the TLE2426 eliminates a major source of system error.
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类型 标题 下载最新的英语版本 日期
* 数据表 The Rail Splitter Precision Virtual Ground 数据表 2006年 3月 20日
* VID TLE2426-EP VID V6206601 2016年 6月 21日

设计和开发

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仿真模型

TLE2426 PSpice Model (Rev. B)

SLFJ004B.ZIP (18 KB) - PSpice Model
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模拟工具

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模拟工具

TINA-TI — 基于 SPICE 的模拟仿真程序

TINA-TI 提供了 SPICE 所有的传统直流、瞬态和频域分析以及更多。TINA 具有广泛的后处理功能，允许您按照希望的方式设置结果的格式。虚拟仪器允许您选择输入波形、探针电路节点电压和波形。TINA 的原理图捕获非常直观 - 真正的“快速入门”。

TINA-TI 安装需要大约 500MB。直接安装，如果想卸载也很容易。我们相信您肯定会爱不释手。

TINA 是德州仪器 (TI) 专有的 DesignSoft 产品。该免费版本具有完整的功能，但不支持完整版 TINA 所提供的某些其他功能。

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用户指南: PDF
英语版 (Rev.A): PDF
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封装 引脚 下载
SOIC (D) 8 查看选项
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订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

支持和培训

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