ZHCSGR5 September 2017 TIC12400

PRODUCTION DATA. 

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1Absolute Maximum Ratings
    2. 6.2ESD Ratings
    3. 6.3Recommended Operating Conditions
    4. 6.4Thermal Information
    5. 6.5Electrical Characteristics
    6. 6.6Timing Requirements
    7. 6.7Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1Overview
    2. 8.2Functional Block Diagram
    3. 8.3Feature Description
      1. 8.3.1 VS Pin
      2. 8.3.2 VDD Pin
      3. 8.3.3 Device Initialization
      4. 8.3.4 Device Trigger
      5. 8.3.5  Device Reset
        1. 8.3.5.1VS Supply POR
        2. 8.3.5.2Hardware Reset
        3. 8.3.5.3Software Reset
      6. 8.3.6 VS Under-Voltage (UV) Condition
      7. 8.3.7 VS Over-Voltage (OV) Condition
      8. 8.3.8 Switch inputs Settings
        1. 8.3.8.1Input Current Source/Sink Selection
        2. 8.3.8.2Input Mode Selection
        3. 8.3.8.3Input Enable Selection
        4. 8.3.8.4Thresholds Adjustment
        5. 8.3.8.5Wetting Current Configuration
      9. 8.3.9 Interrupt Generation and INT Assertion
        1. 8.3.9.1INT Pin Assertion Scheme
        2. 8.3.9.2Interrupt Idle Time (tINT_IDLE) Time
        3. 8.3.9.3Microcontroller Wake-Up
        4. 8.3.9.4Interrupt Enable/disable And Interrupt generation Conditions
        5. 8.3.9.5Detection Filter
      10. 8.3.10Temperature Monitor
        1. 8.3.10.1Temperature Warning (TW)
        2. 8.3.10.2Temperature Shutdown (TSD)
      11. 8.3.11Parity Check And Parity Generation
      12. 8.3.12Cyclic Redundancy Check (CRC)
    4. 8.4Device Functional Modes
      1. 8.4.1Continuous Mode
      2. 8.4.2Polling Mode
        1. 8.4.2.1Standard Polling
        2. 8.4.2.2Matrix Polling
      3. 8.4.3Additional Features
        1. 8.4.3.1Clean Current Polling (CCP)
        2. 8.4.3.2Wetting Current Auto-Scaling
        3. 8.4.3.3VS Measurement
        4. 8.4.3.4Wetting Current Diagnostic
        5. 8.4.3.5ADC Self-Diagnostic
    5. 8.5Programming
      1. 8.5.1SPI Communication Interface Buses
        1. 8.5.1.1Chip Select (CS)
        2. 8.5.1.2System Clock (SCLK)
        3. 8.5.1.3Slave In (SI)
        4. 8.5.1.4Slave Out (SO)
      2. 8.5.2SPI Sequence
        1. 8.5.2.1Read Operation
        2. 8.5.2.2Write Operation
        3. 8.5.2.3Status Flag
    6. 8.6Register Maps
      1. 8.6.1 DEVICE_ID register (Offset = 1h) [reset = 20h]
      2. 8.6.2 INT_STAT Register (Offset = 2h) [reset = 1h]
      3. 8.6.3 CRC Register (Offset = 3h) [reset = FFFFh]
      4. 8.6.4 IN_STAT_MISC Register (Offset = 4h) [reset = 0h]
      5. 8.6.5 IN_STAT_COMP Register (Offset = 5h) [reset = 0h]
      6. 8.6.6 IN_STAT_ADC0 Register (Offset = 6h) [reset = 0h]
      7. 8.6.7 IN_STAT_ADC1 Register (Offset = 7h) [reset = 0h]
      8. 8.6.8 IN_STAT_MATRIX0 Register (Offset = 8h) [reset = 0h]
      9. 8.6.9 IN_STAT_MATRIX1 Register (Offset = 9h) [reset = 0h]
      10. 8.6.10ANA_STAT0 Register (Offset = Ah) [reset = 0h]
      11. 8.6.11ANA_STAT1 Register (Offset = Bh) [reset = 0h]
      12. 8.6.12ANA_STAT2 Register (Offset = Ch) [reset = 0h]
      13. 8.6.13ANA_STAT3 Register (Offset = Dh) [reset = 0h]
      14. 8.6.14ANA_STAT4 Register (Offset = Eh) [reset = 0h]
      15. 8.6.15ANA_STAT5 Register (Offset = Fh) [reset = 0h]
      16. 8.6.16ANA_STAT6 Register (Offset = 10h) [reset = 0h]
      17. 8.6.17ANA_STAT7 Register (Offset = 11h) [reset = 0h]
      18. 8.6.18ANA_STAT8 Register (Offset = 12h) [reset = 0h]
      19. 8.6.19ANA_STAT9 Register (Offset = 13h) [reset = 0h]
      20. 8.6.20ANA_STAT10 Register (Offset = 14h) [reset = 0h]
      21. 8.6.21ANA_STAT11 Register (Offset = 15h) [reset = 0h]
      22. 8.6.22ANA_STAT12 Register (Offset = 16h) [reset = 0h]
      23. 8.6.23CONFIG Register (Offset = 1Ah) [reset = 0h]
      24. 8.6.24IN_EN Register (Offset = 1Bh) [reset = 0h]
      25. 8.6.25CS_SELECT Register (Offset = 1Ch) [reset = 0h]
      26. 8.6.26WC_CFG0 Register (Offset = 1Dh) [reset = 0h]
      27. 8.6.27WC_CFG1 Register (Offset = 1Eh) [reset = 0h]
      28. 8.6.28CCP_CFG0 Register (Offset = 1Fh) [reset = 0h]
      29. 8.6.29CCP_CFG1 Register (Offset = 20h) [reset = 0h]
      30. 8.6.30THRES_COMP Register (Offset = 21h) [reset = 0h]
      31. 8.6.31INT_EN_COMP1 Register (Offset = 22h) [reset = 0h]
      32. 8.6.32INT_EN_COMP2 Register (Offset = 23h) [reset = 0h]
      33. 8.6.33INT_EN_CFG0 Register (Offset = 24h) [reset = 0h]
      34. 8.6.34INT_EN_CFG1 Register (Offset = 25h) [reset = 0h]
      35. 8.6.35INT_EN_CFG2 Register (Offset = 26h) [reset = 0h]
      36. 8.6.36INT_EN_CFG3 Register (Offset = 27h) [reset = 0h]
      37. 8.6.37INT_EN_CFG4 Register (Offset = 28h) [reset = 0h]
      38. 8.6.38THRES_CFG0 Register (Offset = 29h) [reset = 0h]
      39. 8.6.39THRES_CFG1 Register (Offset = 2Ah) [reset = 0h]
      40. 8.6.40THRES_CFG2 Register (Offset = 2Bh) [reset = 0h]
      41. 8.6.41THRES_CFG3 Register (Offset = 2Ch) [reset = X]
      42. 8.6.42THRES_CFG4 Register (Offset = 2Dh) [reset = X]
      43. 8.6.43THRESMAP_CFG0 Register (Offset = 2Eh) [reset = 0h]
      44. 8.6.44THRESMAP_CFG1 Register (Offset = 2Fh) [reset = 0h]
      45. 8.6.45THRESMAP_CFG2 Register (Offset = 30h) [reset = 0h]
      46. 8.6.46Matrix Register (Offset = 31h) [reset = 0h]
      47. 8.6.47Mode Register (Offset = 32h) [reset = 0h]
    7. 8.7Programming Guidelines
  9. Application and Implementation
    1. 9.1Application Information
    2. 9.2Digital IO Switches and Analog Voltage Monitoring
      1. 9.2.1Design Requirements
      2. 9.2.2Detailed Design Procedure
      3. 9.2.3Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1Layout Guidelines
    2. 11.2Layout Example
  12. 12器件和文档支持
    1. 12.1接收文档更新通知
    2. 12.2社区资源
    3. 12.3商标
    4. 12.4静电放电警告
    5. 12.5Glossary
  13. 13机械、封装和可订购信息

特性

  • 工作电源电压 (VS) 范围为 6.5V 至 35V,具有过压和欠压警告
  • 监控多达 24 路直接开关输入,并可配置其中 10 路输入以监控接地或连接到电源的开关
  • 开关输入可接受 40V 电压和低至 -24V 的反向供电条件
  • 6 种可配置的湿性电流设置:
    (0mA、1mA、2mA、5mA、10mA 和 15mA)
  • 适用于多位模拟开关监控的 10 位集成 ADC
  • 适用于输入监控并具有 4 个可编程阈值的集成比较器
  • 在轮询模式下具有超低工作电流:
    典型值为 68μA(tPOLL = 64ms,tPOLL_ACT = 128μs,
    全部 24 路输入均处于活动状态,比较器模式,所有开关均打开)
  • 使用 3.3V/5V 串行外设接口 (SPI) 协议直接与 MCU 连接
  • 可产生中断来支持所有输入的唤醒操作
  • 集成电源和温度传感
  • 采用适当的外部组件根据 IEC 61000-4-2 在输入引脚上实现 ±8kV 接触放电 ESD 保护
  • 38 引脚 TSSOP 封装

应用

  • 信号测量
  • PLC、DCS 和 PAC
  • 仪表

说明

TIC12400 是一款先进的多开关检测接口 (MSDI) 器件,用于检测外部开关状态。TIC12400 支持 24 路直接输入,并可配置其中 10 路输入以监控数字 I/O 开关。可为每路输入设定 6 种湿性电流设置,从而支持不同的应用场景。TIC12400 采用了 集成的 10 位 ADC 对多位模拟开关进行监控,并采用比较器来独立于 MCU 对数字开关进行监控。该器件支持所有开关输入的唤醒操作,因此无需持续使 MCU 保持活动状态,进而可降低系统功耗。TIC12400 支持 2 种工作模式:连续模式和轮询模式。连续模式下将连续提供湿性电流。轮询模式下将根据可编程计时器来定期接通湿性电流以对输入状态进行采样,从而显著降低系统功耗。TIC12400 还提供各种故障检测和诊断 特性 以提高系统稳健性。

器件信息(1)

器件型号封装封装尺寸(标称值)
TIC12400TSSOP (38)9.70 mm x 4.40 mm
  1. 如需了解所有可用封装,请参阅产品说明书末尾的可订购产品附录。

简化电路原理图

TIC12400 App_diagram.gif