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Configurable & programmable logic ICs
Programmable logic arrays (PLA)

TIBPAL16R4-15M

不推荐用于新设计

高性能 Impact PAL 电路

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数据表

TIBPAL16R4-15M

不推荐用于新设计
数据表 立即订购

产品详情

Rating Military Operating temperature range (°C) -55 to 125
Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 20 167.464 mm² 24.2 x 6.92 CFP (W) 20 90.5828 mm² 13.09 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • High-Performance Operation: Propagation Delay . . . 15 ns Max
  • Power-Up Clear on Registered Devices (All Register Outputs are Set High,
    but Voltage Levels at the Output Pins Go Low)
  • Package Options Include Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) 300-mil DIPs
  • Dependable Texas Instruments Quality and Reliability

IMPACT is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.
  • High-Performance Operation: Propagation Delay . . . 15 ns Max
  • Power-Up Clear on Registered Devices (All Register Outputs are Set High,
    but Voltage Levels at the Output Pins Go Low)
  • Package Options Include Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) 300-mil DIPs
  • Dependable Texas Instruments Quality and Reliability

IMPACT is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT-X™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.

The TIBPAL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.

IMPORTANT PROGAMMING NOTE: For TIBPAL16L8-15M devices in J, W, or FK packages - For date code 9903A or later device programming, select from either TI Military/16L8-12 or TI commercial TI/16L8-10 on the Manufacturer/Device menu listing in your programming system.

IMPORTANT PROGAMMING NOTE: For TIBPAL16R4-15M devices in J, W, or FK packages - For date code 9616A or later device programming, select from either TI Military/16R4-12 or TI commercial TI /16R4-10 on the Manufacturer/Device menu listing in your programming system.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT-X™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.

The TIBPAL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.

IMPORTANT PROGAMMING NOTE: For TIBPAL16L8-15M devices in J, W, or FK packages - For date code 9903A or later device programming, select from either TI Military/16L8-12 or TI commercial TI/16L8-10 on the Manufacturer/Device menu listing in your programming system.

IMPORTANT PROGAMMING NOTE: For TIBPAL16R4-15M devices in J, W, or FK packages - For date code 9616A or later device programming, select from either TI Military/16R4-12 or TI commercial TI /16R4-10 on the Manufacturer/Device menu listing in your programming system.
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类型 标题 下载最新的英语版本 日期
* 数据表 High-Performance Impact Programmable Array Logic Circuits.. 数据表 (Rev. B) 2011年 11月 2日
* SMD TIBPAL16R4-15M SMD 5962-85155 2016年 6月 21日

设计和开发

如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。

封装 引脚 下载
CDIP (J) 20 查看选项
CFP (W) 20 查看选项
LCCC (FK) 20 查看选项
应遵守 TI 评估类商品的标准条款与条件。

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

支持和培训

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