产品详情

Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.5 Clock frequency (max) (MHz) 40 Supply current (max) (µA) 100000 Rating Military Operating temperature range (°C) -55 to 125
Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.5 Clock frequency (max) (MHz) 40 Supply current (max) (µA) 100000 Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 20 167.464 mm² 24.2 x 6.92 CFP (W) 20 90.5828 mm² 13.09 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • High-Performance Operation:
  • Propagation Delay
  • C Suffix...15 ns Max
  • M Suffix...20 ns Max
  • Functionally Equivalent, but Faster Than PAL16L8A, PAL16R4A, PAL16R6A, and PAL16R8A
  • Power-Up Clear on Registered Devices (All Register Outputs Are Set High, but Voltage Levels at the Output Pins Go Low)
  • Package Options Include Both Plastic and Ceramic Chip Carriers in Addition to Plastic and Ceramic DIPs
  • Dependable Texas Instruments Quality and Reliability
    DEVICE
    I
    INPUTS
    3-STATE
    O
    OUTPUTS
    REGISTERED
    Q
    OUTPUTS
    I/O
    PORTS
    PAL16L8
    10
    2
    0
    6
    PAL16R4
    8
    0
    4 (3-state buffers)
    4
    PAL16R6
    8
    0
    6 (3-state buffers)
    2
    PAL16R8
    8
    0
    8 (3-state buffers)
    0

    These devices are covered by U.S. Patent 4,410,987.
    IMPACT is a trademark of Texas Instruments.
    PAL is a registered trademark of Advanced Micro Devices Inc.

  • High-Performance Operation:
  • Propagation Delay
  • C Suffix...15 ns Max
  • M Suffix...20 ns Max
  • Functionally Equivalent, but Faster Than PAL16L8A, PAL16R4A, PAL16R6A, and PAL16R8A
  • Power-Up Clear on Registered Devices (All Register Outputs Are Set High, but Voltage Levels at the Output Pins Go Low)
  • Package Options Include Both Plastic and Ceramic Chip Carriers in Addition to Plastic and Ceramic DIPs
  • Dependable Texas Instruments Quality and Reliability
    DEVICE
    I
    INPUTS
    3-STATE
    O
    OUTPUTS
    REGISTERED
    Q
    OUTPUTS
    I/O
    PORTS
    PAL16L8
    10
    2
    0
    6
    PAL16R4
    8
    0
    4 (3-state buffers)
    4
    PAL16R6
    8
    0
    6 (3-state buffers)
    2
    PAL16R8
    8
    0
    8 (3-state buffers)
    0

    These devices are covered by U.S. Patent 4,410,987.
    IMPACT is a trademark of Texas Instruments.
    PAL is a registered trademark of Advanced Micro Devices Inc.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACTTM circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The TIBPAL16' C series is characterized from 0°C to 75°C. The TIBPAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACTTM circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The TIBPAL16' C series is characterized from 0°C to 75°C. The TIBPAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.

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类型 标题 下载最新的英语版本 日期
* 数据表 High-Performance Impact Programmable Array Logic Circuits 数据表 (Rev. A) 2000年 4月 4日
* SMD TIBPAL16L8-20M SMD 5962-85155 2016年 6月 21日

设计和开发

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封装 引脚 下载
CDIP (J) 20 查看选项
CFP (W) 20 查看选项
LCCC (FK) 20 查看选项

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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