ZHCSEK0A November   2015  – November 2015 THS4541-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Family Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: (Vs+) - Vs- = 5 V
    6. 7.6 Electrical Characteristics: (Vs+) - Vs- = 3 V
    7. 7.7 Typical Characteristics
      1. 7.7.1 5-V Single Supply
      2. 7.7.2 3-V Single Supply
      3. 7.7.3 3-V to 5-V Supply Range
  8. 8 Parameter Measurement Information
    1. 8.1 Example Characterization Circuits
    2. 8.2 Frequency-Response Shape Factors
    3. 8.3 I/O Headroom Considerations
    4. 8.4 Output DC Error and Drift Calculations and the Effect of Resistor Imbalances
    5. 8.5 Noise Analysis
    6. 8.6 Factors Influencing Harmonic Distortion
    7. 8.7 Driving Capacitive Loads
    8. 8.8 Thermal Analysis
  9. 9 Detailed Description
    1. 9.1 Overview
      1. 9.1.1 Terminology and Application Assumptions
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Differential I/O
      2. 9.3.2 Power-Down Control Pin (PD)
        1. 9.3.2.1 Operating the Power Shutdown Feature
      3. 9.3.3 Input Overdrive Operation
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation from Single-Ended Sources to Differential Outputs
        1. 9.4.1.1 AC-Coupled Signal Path Considerations for Single-Ended Input to Differential Output Conversion
        2. 9.4.1.2 DC-Coupled Input Signal Path Considerations for Single-Ended to Differential Conversion
        3. 9.4.1.3 Resistor Design Equations for the Single-Ended to Differential Configuration of the FDA
        4. 9.4.1.4 Input Impedance for the Single-Ended to Differential FDA Configuration
      2. 9.4.2 Differential-Input to Differential-Output Operation
        1. 9.4.2.1 AC-Coupled, Differential-Input to Differential-Output Design Issues
        2. 9.4.2.2 DC-Coupled, Differential-Input to Differential-Output Design Issues
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Designing Attenuators
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Interfacing to High-Performance ADCs
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
  11. 11Power-Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 开发支持
        1. 13.1.1.1 TINA 仿真模型 特性
    2. 13.2 文档支持
      1. 13.2.1 相关文档　
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 器件和文档支持

13.1 器件支持

13.1.1 开发支持

13.1.1.1 TINA 仿真模型 特性

器件模型作为 TINA 模型库的一部分提供。此模型包含多种 功能， 旨在帮助设计人员加快设计过程，从而满足各类应用需求。下面列出了模型中所包含的性能参数：

  • 采用任意外部电路时的小信号响应波形：
    • 差分开环增益和相位
    • 寄生输入电容
    • 开环差分输出阻抗
  • 对于噪声仿真：
    • 输入差分点电压噪声和 100kHz 1/f 转角频率
    • 每个输入上的输入电流噪声与 1MHz 1/f 转角频率
  • 对于时域阶跃响应仿真：
    • 差分转换率
    • 用于预测削波的 I/O 余量模型
    • 精密的直流精度术语：
      • 电源抑制比 (PSRR)
      • 共模抑制比 (CMRR)

典型特性曲线所呈现的信息比宏观模型提供的更为详细；其中一些非模型化的 特性 包括：

  • 谐波失真
  • 直流误差方面的温度漂移（VIO 和 IOS）

13.2 文档支持

13.2.1 相关文档　

相关文档如下：

  • 《ADC34J2x 具有 JESD204B 接口的四通道 12 位 50MSPS 至 160MSPS 模数转换器》，SBAS669
  • 《宽带、差分互阻抗 DAC 输出设计》，
  • 《扩展全差分放大器的轨到轨输出范围以包括真正零电压》，TIDU187
  • 《LM7705 低噪声负偏置发生器》，SNVS420
  • 《LMH6554 2.8GHz 超线性全差分放大器》，SNOSB30
  • 《THS4541RGT EVM 用户指南》，SLOU392

13.3 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.4 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

13.5 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

13.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.