TB5T1
- Functional Replacement for the Agere BTF1A
- Driver Features
- Third-State Logic Low Output
- ESD Protection HBM > 3 kV, CDM > 2 kV
- No Line Loading when VCC = 0
- Capable of Driving 50- loads
- 2.0-ns Maximum Propagation Delay
- 0.2-ns Output Skew (typical)
- Receiver Features
- High-Input Impedance Approximately 8 k
- 4.0-ns Maximum Propagation Delay
- 50-mV Hysteresis
- Slew Rate Limited (1 ns min 80% to 20%)
- ESD Protection HBM > 3 kV, CDM > 2 kV
- -1.1-V to 7.1-V Input Voltage Range
- Common Device Features
- Common Enable for Each Driver/Receiver Pair
- Operating Temperature Range: -40°C to 85°C
- Single 5.0 V ± 10% Supply
- Available in Gull-Wing SOIC (JEDEC MS-013, DW) and SOIC (D) Package
The TB5T1 device is a dual differential driver/receiver circuit that transmits and receives digital data over balanced transmission lines. The dual drivers translate input TTL logic levels to differential pseudo-ECL output levels. The dual receivers convert differential-input logic levels to TTL output levels. Each driver or receiver pair has its own common enable control allowing serial data and a control clock to be transmitted and received on a single integrated circuit. The TB5T1 requires the customer to supply termination resistors on the circuit board.
The power-down loading characteristics of the receiver input circuit are approximately 8 k relative to the power supplies; hence, it does not load the transmission line when the circuit is powered down.
In circuits with termination resistors, the line remains impedance- matched when the circuit is powered down. The driver does not load the line when it is powered down.
All devices are characterized for operation from -40°C to 85°C.
The logic inputs of this device include internal pull-up resistors of approximately 40 k that are connected to VCC to ensure a logical high level input if the inputs are open circuited.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | TB5T1, Dual Differential PECL Driver/Receiver 数据表 (Rev. C) | 2007年 10月 23日 |
设计和开发
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封装 | 引脚 | 下载 |
---|---|---|
SOIC (D) | 16 | 查看选项 |
SOIC (DW) | 16 | 查看选项 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点