TAS5601
- Supports Multiple Output Configurations
- 2×20-W into a 8-Ω BTL Load at 18 V
- 4×10-W into a 4-Ω SE Load at 18 V
- 2×10W (SE) + 1×20W (BTL) at 18 V
- Thermally Enhanced Package
- DCA (56-pin HTTSOP)
- Wide Voltage Range: 10V—26V
- No Separate Supply Required for Gate Drive
- Efficient Class-D Operation Eliminates Need for Heat Sinks
- Closed Loop Power Stage Architecture
- Improved PSRR Reduces Power Supply Performance Requirements
- High Damping Factor Provides for Tighter, More Accurate Sound With Improved Bass Response
- Constant Output Power Over Variation in Supply Voltage
- Differential Inputs
- Integrated Self-Protection Circuits Including Overvoltage, Undervoltage, Overtemperature, and Short Circuit With Error Reporting
- APPLICATIONS
- Flat-Panel, Rear-Projection, and CRT TV
The TAS5601 is a 20-W (per channel) efficient, stereo digital amplifier power stage for driving 4 single-ended speakers, 2 bridge-tied speakers, or combination of single and bridge-tied loads. The TAS5601 can drive a speaker with an impedance as low as 4Ω. The high efficiency, >90% into 8-Ω loads, of the TAS5601 eliminates the need for an external heat sink.
A simple interface to a digital audio PWM processor is shown below. The TAS5601 is fully protected against faults with short-circuit protection and thermal protection as well as overvoltage and undervoltage protection. Faults are reported back to the processor to prevent devices from being damaged during overload conditions.
技术文档
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查看全部 4 类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | TAS5601 20W Stereo (BTL) Digital Amplifier Power Stage 数据表 (Rev. A) | 2008年 9月 29日 | |||
应用手册 | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019年 8月 26日 | ||||
应用手册 | AN-1849 An Audio Amplifier Power Supply Design (Rev. C) | 2019年 6月 27日 | ||||
应用手册 | AN-1737 Managing EMI in Class D Audio Applications (Rev. A) | 2013年 5月 1日 |
设计和开发
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模拟工具
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封装 | 引脚 | 下载 |
---|---|---|
HTSSOP (DCA) | 56 | 查看选项 |
订购和质量
包含信息:
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
包含信息:
- 制造厂地点
- 封装厂地点