SN74LVC2G06
- Available in the Texas Instruments
Package - Supports 5-V VCC Operation
- Max tpd of 3.4 ns at 3.3 V
- Low Power Consumption, 10-µA Max ICC
- ±24-mA Output Drive at 3.3 V
- Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C - Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C - Inputs and Open-Drain Outputs Accept
Voltages up to 5.5 V - Ioff Supports Live Insertion, Partial-Power-Down
Mode and Back-Drive Protection - Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II - Supports Down-Translation
(5 V to 3.3 V and 3.3 V to 1.8 V) - ESD Protection Exceeds JESD 22
- 2000-V Human Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
This dual inverter buffer and driver is designed for 1.65-V to 5.5-V VCC operation.
The output of the SN74LVC2G06 device is an open-drain which can be connected to other open-drain outputs to implement active-low, wired-OR, or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
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5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑评估模块
灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
用户指南: PDF
封装 | 引脚 | 下载 |
---|---|---|
DSBGA (YZP) | 6 | 查看选项 |
SOT-23 (DBV) | 6 | 查看选项 |
SOT-SC70 (DCK) | 6 | 查看选项 |
USON (DRY) | 6 | 查看选项 |
X2SON (DSF) | 6 | 查看选项 |
订购和质量
包含信息:
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
包含信息:
- 制造厂地点
- 封装厂地点