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SN74CBT3125

不推荐用于新设计

具有标准的 '125 型引脚排列的 5V、1:1 (SPST)、4 通道、通用 FET 总线开关

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数据表

SN74CBT3125

不推荐用于新设计
数据表 立即订购

产品详情

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 5 Protocols Analog Ron (typ) (Ω) 5 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 128 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 5 Protocols Analog Ron (typ) (Ω) 5 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 128 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
SOIC (D) 14 51.9 mm² 8.65 x 6 SSOP (DB) 14 48.36 mm² 6.2 x 7.8 SSOP (DBQ) 16 29.4 mm² 4.9 x 6 TSSOP (PW) 14 32 mm² 5 x 6.4 TVSOP (DGV) 14 23.04 mm² 3.6 x 6.4
  • Standard ’125-Type Pinout (D, DB, DGV, and PW Packages)
  • 5- Switch Connection Between Two Ports
  • TTL-Compatible Input Levels
  • Standard ’125-Type Pinout (D, DB, DGV, and PW Packages)
  • 5- Switch Connection Between Two Ports
  • TTL-Compatible Input Levels

The SN74CBT3125 quadruple FET bus switch features independent line switches. Each switch is disabled when the associated output-enable (OE)\ input is high.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74CBT3125 quadruple FET bus switch features independent line switches. Each switch is disabled when the associated output-enable (OE)\ input is high.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
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* 数据表 SN74CBT3125 数据表 (Rev. I) 2002年 9月 19日

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点