产品详情

Technology family BCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 64 IOH (max) (mA) -15 Supply current (max) (µA) 71000 Input type Bipolar Output type 3-State Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) 0 to 70
Technology family BCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 64 IOH (max) (mA) -15 Supply current (max) (µA) 71000 Input type Bipolar Output type 3-State Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) 0 to 70
PDIP (N) 20 228.702 mm² 24.33 x 9.4 SOIC (DW) 20 131.84 mm² 12.8 x 10.3
  • Operating Voltage Range of 4.5 V to 5.5 V
  • State-of-the-Art BiCMOS Design Significantly Reduces ICCZ
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)

  • Operating Voltage Range of 4.5 V to 5.5 V
  • State-of-the-Art BiCMOS Design Significantly Reduces ICCZ
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)

These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the ’BCT241 and ’BCT244 devices, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical (OE)\ (active-low output-enable) inputs, and complementary OE and (OE)\ inputs. These devices feature high fan-out and improved fan-in.

To ensure the high-impedance state during power up or power down, (OE)\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the ’BCT241 and ’BCT244 devices, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical (OE)\ (active-low output-enable) inputs, and complementary OE and (OE)\ inputs. These devices feature high fan-out and improved fan-in.

To ensure the high-impedance state during power up or power down, (OE)\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

下载 观看带字幕的视频 视频

您可能感兴趣的相似产品

open-in-new 比较替代产品
功能与比较器件相同且具有相同引脚
SN74AHCT240 正在供货 具有 TTL 兼容型 CMOS 输入的 8 通道 4.5V 至 5.5V 反相器 Larger voltage range (2V to 5.5V)

技术文档

star =有关此产品的 TI 精选热门文档
未找到结果。请清除搜索并重试。
查看全部 12
类型 标题 下载最新的英语版本 日期
* 数据表 SN54BCT240, SN74BCT240 数据表 (Rev. F) 2003年 3月 11日
应用手册 Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
应用手册 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
应用手册 Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
应用手册 使用逻辑器件进行设计 (Rev. C) 1997年 6月 1日
应用手册 Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
应用手册 Live Insertion 1996年 10月 1日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

评估板

14-24-LOGIC-EVM — 采用 14 引脚至 24 引脚 D、DB、DGV、DW、DYY、NS 和 PW 封装的逻辑产品通用评估模块

14-24-LOGIC-EVM 评估模块 (EVM) 旨在支持采用 14 引脚至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。

用户指南: PDF | HTML
英语版 (Rev.B): PDF | HTML
TI.com 上无现货
仿真模型

SN74BCT240 Behavioral SPICE Model

SCBM133.ZIP (7 KB) - PSpice Model
封装 引脚 下载
PDIP (N) 20 查看选项
SOIC (DW) 20 查看选项

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

视频