产品详情

Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 1 IOL (max) (mA) 4 Supply current (max) (µA) 0.9 IOH (max) (mA) -4 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 1 IOL (max) (mA) 4 Supply current (max) (µA) 0.9 IOH (max) (mA) -4 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YFP) 4 1 mm² 1 x 1 DSBGA (YZP) 5 2.1875 mm² 1.75 x 1.25 SOT-23 (DBV) 5 8.12 mm² 2.9 x 2.8 SOT-5X3 (DRL) 5 2.56 mm² 1.6 x 1.6 SOT-SC70 (DCK) 5 4.2 mm² 2 x 2.1 USON (DRY) 6 1.45 mm² 1.45 x 1 X2SON (DPW) 5 0.64 mm² 0.8 x 0.8 X2SON (DSF) 6 1 mm² 1 x 1
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 4.4 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Includes Schmitt-Trigger Inputs
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 5.1 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 4.4 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Includes Schmitt-Trigger Inputs
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 5.1 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications

The AUP family of devices is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (see AUP – The Lowest-Power Family and Excellent Signal Integrity).

This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching-noise immunity at the input.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

The AUP family of devices is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (see AUP – The Lowest-Power Family and Excellent Signal Integrity).

This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching-noise immunity at the input.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

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类型 标题 下载最新的英语版本 日期
* 数据表 SN74AUP1G17 Low-Power Single Schmitt-Trigger Buffer 数据表 (Rev. J) PDF | HTML 2017年 9月 29日
应用简报 了解施密特触发器 (Rev. A) PDF | HTML 英语版 (Rev.A) PDF | HTML 2022年 12月 1日
应用简报 对开关进行去抖 PDF | HTML 英语版 PDF | HTML 2022年 5月 19日
选择指南 Little Logic Guide 2018 (Rev. G) 2018年 7月 6日
应用手册 Designing and Manufacturing with TI's X2SON Packages 2017年 8月 23日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 How to Select Little Logic (Rev. A) 2016年 7月 26日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
选择指南 小尺寸逻辑器件指南 (Rev. E) 最新英语版本 (Rev.G) 2012年 7月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

评估板

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灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
用户指南: PDF
TI.com 上无现货
仿真模型

SN74AUP1G17 Behavioral SPICE Model

SCEM686.ZIP (7 KB) - PSpice Model
仿真模型

SN74AUP1G17 IBIS Model (Rev. B)

SCEM425B.ZIP (64 KB) - IBIS Model
参考设计

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设计指南: PDF
原理图: PDF
参考设计

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设计指南: PDF
原理图: PDF
封装 引脚 CAD 符号、封装和 3D 模型
DSBGA (YFP) 4 Ultra Librarian
DSBGA (YZP) 5 Ultra Librarian
SOT-23 (DBV) 5 Ultra Librarian
SOT-5X3 (DRL) 5 Ultra Librarian
SOT-SC70 (DCK) 5 Ultra Librarian
USON (DRY) 6 Ultra Librarian
X2SON (DPW) 5 Ultra Librarian
X2SON (DSF) 6 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

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