产品详情

Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 1 Inputs per channel 2 IOL (max) (mA) 4 IOH (max) (mA) -4 Input type Standard CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 100 Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 1 Inputs per channel 2 IOL (max) (mA) 4 IOH (max) (mA) -4 Input type Standard CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 100 Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YFP) 6 1.4000000000000001 mm² 1 x 1.4000000000000001 DSBGA (YZP) 5 2.1875 mm² 1.75 x 1.25 SOT-23 (DBV) 5 8.12 mm² 2.9 x 2.8 SOT-5X3 (DRL) 5 2.56 mm² 1.6 x 1.6 SOT-SC70 (DCK) 5 4.2 mm² 2 x 2.1 USON (DRY) 6 1.45 mm² 1.45 x 1 X2SON (DPW) 5 0.64 mm² 0.8 x 0.8 X2SON (DSF) 6 1 mm² 1 x 1
  • Available in the Ultra Small 0.64 mm2 Package
    (DPW) With 0.5-mm Pitch
  • Low Static-Power Consumption:
    ICC = 0.9 µA Maximum
  • Low Dynamic-Power Consumption:
    Cpd = 4.3 pF Typical at 3.3 V
  • Low Input Capacitance: Ci = 1.5 pF Typical
  • Low Noise: Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Live Insertion, Partial-Power-Down
    Mode, and Back Drive Protection
  • Schmitt-Trigger Action Allows Slow Input
    Transition and Better Switching Noise Immunity at
    the Input (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal
    Operation
  • tpd = 4.3 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Ultra Small 0.64 mm2 Package
    (DPW) With 0.5-mm Pitch
  • Low Static-Power Consumption:
    ICC = 0.9 µA Maximum
  • Low Dynamic-Power Consumption:
    Cpd = 4.3 pF Typical at 3.3 V
  • Low Input Capacitance: Ci = 1.5 pF Typical
  • Low Noise: Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Live Insertion, Partial-Power-Down
    Mode, and Back Drive Protection
  • Schmitt-Trigger Action Allows Slow Input
    Transition and Better Switching Noise Immunity at
    the Input (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal
    Operation
  • tpd = 4.3 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

This single 2-input positive-AND gate is designed for 0.8-V to 3.6-V VCC operation and performs the Boolean function Y = A • B or Y = A\ + B\ in positive logic.

This single 2-input positive-AND gate is designed for 0.8-V to 3.6-V VCC operation and performs the Boolean function Y = A • B or Y = A\ + B\ in positive logic.

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类型 标题 下载最新的英语版本 日期
* 数据表 SN74AUP1G08 Low-Power Single 2-Input Positive-AND Gate 数据表 (Rev. P) PDF | HTML 2016年 6月 17日
应用简报 Optimizing Industrial Robot CPU Boards with Logic and Voltage Translation PDF | HTML 2022年 12月 12日
应用简报 了解施密特触发器 (Rev. A) PDF | HTML 英语版 (Rev.A) PDF | HTML 2022年 12月 1日
应用简报 Optimizing WLAN and WiFi Access Point Systems With Logic and Voltage Translation PDF | HTML 2022年 11月 3日
选择指南 Little Logic Guide 2018 (Rev. G) 2018年 7月 6日
应用手册 Designing and Manufacturing with TI's X2SON Packages 2017年 8月 23日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 How to Select Little Logic (Rev. A) 2016年 7月 26日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
选择指南 小尺寸逻辑器件指南 (Rev. E) 最新英语版本 (Rev.G) 2012年 7月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

评估板

5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑评估模块

灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
用户指南: PDF
TI.com 上无现货
仿真模型

SN74AUP1G08 Behavioral SPICE Model

SCEM690.ZIP (7 KB) - PSpice Model
仿真模型

SN74AUP1G08 IBIS Model (Rev. A)

SCEM405A.ZIP (65 KB) - IBIS Model
封装 引脚 下载
DSBGA (YFP) 6 查看选项
DSBGA (YZP) 5 查看选项
SOT-23 (DBV) 5 查看选项
SOT-5X3 (DRL) 5 查看选项
SOT-SC70 (DCK) 5 查看选项
USON (DRY) 6 查看选项
X2SON (DPW) 5 查看选项
X2SON (DSF) 6 查看选项

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

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