SN65LV1224B

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100Mbps 至 660Mbps、1:10 LVDS 串行器/解串器接收器

产品详情

Function Deserializer Protocols Channel-Link I Supply voltage (V) 3.3 Signaling rate (MBits) 660 Input signal LVCMOS, LVTTL Output signal LVDS Rating Catalog Operating temperature range (°C) -40 to 85
Function Deserializer Protocols Channel-Link I Supply voltage (V) 3.3 Signaling rate (MBits) 660 Input signal LVCMOS, LVTTL Output signal LVDS Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DB) 28 79.56 mm² 10.2 x 7.8 VQFN (RHB) 32 25 mm² 5 x 5
  • 100-Mbps to 660-Mbps Serial LVDS Data Payload Bandwidth at 10-MHz
    to 66-MHz System Clock
  • Pin-Compatible Superset of DS92LV1023/DS92LV1224
  • Chipset (Serializer/Deserializer) Power Consumption <450 mW (Typ) at 66 MHz
  • Synchronization Mode for Faster Lock
  • Lock Indicator
  • No External Components Required for PLL
  • 28-Pin SSOP and Space Saving 5 × 5 mm QFN Packages Available
  • Industrial Temperature Qualified,
    TA = −40°C to 85°C
  • Programmable Edge Trigger on Clock
  • Flow-Through Pinout for Easy PCB Layout
  • APPLICATIONS
    • Wireless Base Station
    • Backplane Interconnect
    • DSLAM

  • 100-Mbps to 660-Mbps Serial LVDS Data Payload Bandwidth at 10-MHz
    to 66-MHz System Clock
  • Pin-Compatible Superset of DS92LV1023/DS92LV1224
  • Chipset (Serializer/Deserializer) Power Consumption <450 mW (Typ) at 66 MHz
  • Synchronization Mode for Faster Lock
  • Lock Indicator
  • No External Components Required for PLL
  • 28-Pin SSOP and Space Saving 5 × 5 mm QFN Packages Available
  • Industrial Temperature Qualified,
    TA = −40°C to 85°C
  • Programmable Edge Trigger on Clock
  • Flow-Through Pinout for Easy PCB Layout
  • APPLICATIONS
    • Wireless Base Station
    • Backplane Interconnect
    • DSLAM

The SN65LV1023A serializer and SN65LV1224B deserializer comprise a 10-bit serdes chipset designed to transmit and receive serial data over LVDS differential backplanes at equivalent parallel word rates from 10 MHz to 66 MHz. Including overhead, this translates into a serial data rate between 120-Mbps and 792-Mbps payload encoded throughput.

Upon power up, the chipset link can be initialized via a synchronization mode with internally generated SYNC patterns or the deserializer can be allowed to synchronize to random data. By using the synchronization mode, the deserializer establishes lock within specified, shorter time parameters.

The device can be entered into a power-down state when no data transfer is required. Alternatively, a mode is available to place the output pins in the high-impedance state without losing PLL lock.

The SN65LV1023A and SN65LV1224B are characterized for operation over ambient air temperature of –40°C to 85°C.

The SN65LV1023A serializer and SN65LV1224B deserializer comprise a 10-bit serdes chipset designed to transmit and receive serial data over LVDS differential backplanes at equivalent parallel word rates from 10 MHz to 66 MHz. Including overhead, this translates into a serial data rate between 120-Mbps and 792-Mbps payload encoded throughput.

Upon power up, the chipset link can be initialized via a synchronization mode with internally generated SYNC patterns or the deserializer can be allowed to synchronize to random data. By using the synchronization mode, the deserializer establishes lock within specified, shorter time parameters.

The device can be entered into a power-down state when no data transfer is required. Alternatively, a mode is available to place the output pins in the high-impedance state without losing PLL lock.

The SN65LV1023A and SN65LV1224B are characterized for operation over ambient air temperature of –40°C to 85°C.

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类型 标题 下载最新的英语版本 日期
* 数据表 10-MHz to 66-MHz, 10:1-LVDS Serializer/Deserializer 数据表 (Rev. E) 2009年 12月 7日
应用手册 低压差分信号 (LVDS) 在 LED 灯墙中的应用 英语版 2022年 5月 19日
应用简报 Migrating from DS92LV1021A/1212A 10-bit SerDes to SN65LV1023A/1224B 2018年 11月 15日
用户指南 10:1 Serializer/Deserializer Evaluation Board 2013年 11月 20日

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用户指南: PDF
英语版 (Rev.A): PDF
封装 引脚 下载
SSOP (DB) 28 查看选项
VQFN (RHB) 32 查看选项

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  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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  • 封装厂地点

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