SPNS155I
September 2009 – June 2015
SM470R1B1M-HT
PRODUCTION DATA.
1
Device Overview
1.1
Features
1.2
Applications
1.3
Description
1.4
Functional Block Diagram
2
Revision History
3
Device Characteristics
4
Bare Die
4.1
Bare Die Information
5
Pin Configuration and Functions
5.1
Features
5.2
Pin Functions (HFQ/HKP Package)
5.3
Pin Functions (PGE Package)
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Electrical Characteristics
6.5
Thermal Characteristics
6.6
ZPLL and Clock Specifications
6.7
RST and PORRST Timings
6.8
JTAG Scan Interface Timing
6.9
Output Timings
6.10
Input Timings
6.11
Flash Timings
6.12
SPIn Master Mode Timing Parameters
6.13
SPIn Slave Mode Timing Parameters
6.14
SCIN Isosynchronous Mode Timings - Internal Clock
6.15
SCIN Isosynchronous Mode Timings - External Clock
6.16
I2C Timing
6.17
Standard Can Controller (SCC) Mode Timings
6.18
Expansion Bus Module Timing
6.19
Multi-Buffered A-to-D Converter (MibADC)
7
Parameter Measurement Information
7.1
External Reference Resonator/Crystal Oscillator Clock Option
8
Detailed Description
8.1
Overview
8.1.1
MibADC
8.1.1.1
MibADC Event Trigger Enhancements
8.1.2
JTAG Interface
8.1.3
High-End Timer (HET) Timings
8.1.3.1
Minimum PWM Output Pulse Width
8.1.3.2
Minimum Input Pulses that can be Captured
8.1.4
Interrupt Priority (IEM to CIM)
8.1.5
Expansion Bus Module (EBM)
8.2
Memory
8.2.1
Memory Selects
8.2.1.1
JTAG Security Module
8.2.1.2
Memory Security Module
8.2.1.3
RAM
8.2.1.4
F05 Flash
8.2.1.4.1
Flash Protection Keys
8.2.1.4.2
Flash Read
8.2.1.4.3
Flash Pipeline Mode
8.2.1.4.4
Flash Program and Erase
8.2.1.4.5
HET RAM
8.2.1.4.6
Peripheral Selects and Base Addresses
8.2.1.4.7
Direct-Memory Access (DMA)
9
Device and Documentation Support
9.1
Device Support
9.1.1
Device Identification Code Register
9.1.2
Timing Parameter Symbology
9.2
Development Support
9.3
Device Nomenclature
9.4
Documentation Support
9.5
Community Resources
9.6
Trademarks
9.7
Electrostatic Discharge Caution
9.8
Glossary
10
Mechanical Packaging and Orderable Information
10.1
Packaging Information
封装选项
机械数据 (封装 | 引脚)
KGD|0
散热焊盘机械数据 (封装 | 引脚)
订购信息
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