SBOS673 September 2017 OPA837

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1Absolute Maximum Ratings
    2. 6.2ESD Ratings
    3. 6.3Recommended Operating Conditions
    4. 6.4Thermal Information
    5. 6.5Electrical Characteristics: VS = 5 V
    6. 6.6Electrical Characteristics: VS = 3 V
    7. 6.7Typical Characteristics: VS = 5.0 V
    8. 6.8Typical Characteristics: VS = 3.0 V
    9. 6.9Typical Characteristics: ±2.5-V to ±1.5-V Split Supply
  7. Detailed Description
    1. 7.1Overview
    2. 7.2Functional Block Diagrams
    3. 7.3Feature Description
      1. 7.3.1OPA837 Comparison
      2. 7.3.2Input Common-Mode Voltage Range
      3. 7.3.3Output Voltage Range
      4. 7.3.4Power-Down Operation
      5. 7.3.5Low-Power Applications and the Effects of Resistor Values on Bandwidth
      6. 7.3.6Driving Capacitive Loads
    4. 7.4Device Functional Modes
      1. 7.4.1Split-Supply Operation (±1.35 V to ±2.7 V)
      2. 7.4.2Single-Supply Operation (2.7 V to 5.4 V)
  8. Application and Implementation
    1. 8.1Application Information
      1. 8.1.1 Noninverting Amplifier
      2. 8.1.2 Inverting Amplifier
      3. 8.1.3 Output DC Error Calculations
      4. 8.1.4 Output Noise Calculations
      5. 8.1.5 Instrumentation Amplifier
      6. 8.1.6 Attenuators
      7. 8.1.7 Differential to Single-Ended Amplifier
      8. 8.1.8 Differential-to-Differential Amplifier
      9. 8.1.9 Pulse Application With Single-Supply Circuit
      10. 8.1.10ADC Driver Performance
    2. 8.2Typical Applications
      1. 8.2.1Active Filters
        1. 8.2.1.1Design Requirements
        2. 8.2.1.2Detailed Design Procedure
        3. 8.2.1.3Application Curves
      2. 8.2.2Implementing a 2:1 Active Multiplexer
        1. 8.2.2.1Design Requirements
        2. 8.2.2.2Detailed Design Procedure
      3. 8.2.31-Bit PGA Operation
        1. 8.2.3.1Design Requirements
        2. 8.2.3.2Detailed Design Procedure
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1Layout Guidelines
    2. 10.2Layout Example
  11. 11Device and Documentation Support
    1. 11.1Documentation Support
      1. 11.1.1Related Documentation
    2. 11.2Receiving Notification of Documentation Updates
    3. 11.3Community Resources
    4. 11.4Trademarks
    5. 11.5Electrostatic Discharge Caution
    6. 11.6Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Device and Documentation Support

Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

Community Resources

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Trademarks

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All other trademarks are the property of their respective owners.

Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.