ZHCSGK6 July   2017 ONET2804TLP

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 DC Electrical Characteristics
    5. 6.5 AC Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics: General
    8. 6.8 Typical Characteristics: Eye Diagrams
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Signal Path
      2. 7.3.2 Gain Adjustment
      3. 7.3.3 Amplitude Adjustment
      4. 7.3.4 Rate Select
      5. 7.3.5 Threshold Adjustment
      6. 7.3.6 Filter Circuitry
      7. 7.3.7 AGC and RSSI
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pad Control
      2. 7.4.2 Two-Wire Interface Control
    5. 7.5 Programming
      1. 7.5.1 Bus Idle
      2. 7.5.2 Start Data Transfer
      3. 7.5.3 Stop Data Transfer
      4. 7.5.4 Data Transfer
      5. 7.5.5 Acknowledge
    6. 7.6 Register Maps
      1. 7.6.1  Register Descriptions
      2. 7.6.2  Register 0: Control Settings (address = 00h) [reset = 0h]
      3. 7.6.3  Register 1: Amplitude and Rate for Channel 1 (address = 01h) [reset = 0h]
      4. 7.6.4  Register 2: Threshold and Gain for Channel 1 (address = 02h) [reset = 0h]
      5. 7.6.5  Register 7: Amplitude and Rate for Channel 2 (address = 07h) [reset = 0h]
      6. 7.6.6  Register 8: Threshold and Gain for Channel 1 (address = 08h) [reset = 0h]
      7. 7.6.7  Register 13: Amplitude and Rate for Channel 3 (address = 0Dh) [reset = 0h]
      8. 7.6.8  Register 14: Threshold and Gain for Channel 3 (address = 0Eh) [reset = 0h]
      9. 7.6.9  Register 19: Amplitude and Rate for Channel 4 (address = 13h) [reset = 0h]
      10. 7.6.10 Register 20: Threshold and Gain for Channel 4 (address = 14h) [reset = 0h]
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Pad Control Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Two-Wire Control Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
  • Y|0
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Configuration and Functions

ONET2804TLP Bond Pad Assignment: Y Package
76-Pad Die
Top View
ONET2804TLP sbas796_padout.gif

Bond Pad Functions

PAD I/O DESCRIPTION
NAME NO.
ADR0 54 Digital input 2-wire interface address programming pin. Leave this pad open for a default address of 0001100. Grounding this pad changes the first address bit to a 1 (0001101).
ADR1 53 Digital input 2-wire interface address programming pin. Leave this pad open for a default address of 0001100. Grounding this pad changes the second address bit to a 1 (0001110).
AMPL 6 Digital input 3-state input for amplitude control of all four channels.
VCC: 500-mVPP differential output swing
Open: 300-mVPP differential output swing (default)
GND: 250-mVPP differential output swing
FILTER1 12, 14 Analog output FILTERx is the bias voltage for the photodiode cathode.
These pads are biased to VCC – 100 mV.
FILTER2 19, 21
FILTER3 26, 28
FILTER4 33, 35
GAIN 8 Digital input 3-state input for gain control of all four channels.
VCC: Minimum transimpedance
Open: Default transimpedance
GND: Medium transimpedance
GND 11, 15, 18, 22, 25, 29, 32, 36, 47, 48, 51, 52, 55, 56, 59, 60, 63, 64, 67, 68, 71, 72, 75, 76 Supply Circuit ground. All GND pads are connected on the die.
Bonding all pads is recommended, except for pads 11, 15, 18, 22, 25, 29, 32, and 36.
I2CENA 5 Digital input 2-wire control option. Leave the pad unconnected for pad control of the device.
Two-wire control can be enabled by applying a high signal to the pad.
IN1 13 Analog input INx is the data input to corresponding TIA channel (connect to photodiode anode)
IN2 20
IN3 27
IN4 34
NC 16, 17, 23, 24, 30, 31, 42, 61, 62, 69 No connection Do not connect
NRESET 70 Digital input Used to reset the 2-wire state machine and registers.
Leave open for normal operation and set low to reset the 2-wire interface.
OUT1– 73 Analog output Inverted CML data output for channel x. On-chip, 50-Ω, back-terminated to VCC.
OUT2– 65
OUT3– 57
OUT4– 49
OUT1+ 74 Analog output Noninverted CML data output for channel x. On-chip, 50-Ω, back-terminated to VCC.
OUT2+ 66
OUT3+ 58
OUT4+ 50
RATE 7 Digital input 3-state input for bandwidth control of all four channels.
VCC: Increase the bandwidth
Open: 21-GHz bandwidth (default)
GND: Reduce the bandwidth
RSSI1 9 Analog output Indicates the strength of the received signal (RSSI) for channel x if the photodiode is biased from FILTERx. The analog output current is proportional to the input data amplitude. Connect to an external resistor to ground (GND). For proper operation, ensure that the voltage at the RSSIx pad does not exceed VCC – 0.65 V. If the RSSI feature is not used, leave these pads open.
RSSI2 10
RSSI3 37
RSSI4 38
SCL 40 Digital input 2-wire interface serial clock input. Includes a 10-kΩ pullup resistor to VCC.
SDA 39 Digital input/output 2-wire interface serial data input. Includes a 10-kΩ pullup resistor to VCC.
TRSH 41 Digital input 3-state input for the threshold control.
VCC: Crossing point shifted down
Open: No threshold adjustment (default)
GND: Crossing point shifted up
VCCI1 4 Supply 2.8 V to 3.47 V supply voltage for the input TIAx stage.
VCCI2 3
VCCI3 44
VCCI4 43
VCCO1 1 Supply 2.8 V to 3.47 V supply voltage for the AGCx and CMLx amplifiers.
VCCO2 2
VCCO3 45
VCCO4 46