SNOS458I April   2000  – June 2016 LMV7219

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics 2.7 V
    6. 6.6 Electrical Characteristics 5 V
    7. 6.7 Typical Performance Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Additional Hysteresis
        2. 8.2.2.2 Zero-Crossing Detector
        3. 8.2.2.3 Threshold Detector
        4. 8.2.2.4 Crystal Oscillator
        5. 8.2.2.5 IR Receiver
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Circuit Layout and Bypassing
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from H Revision (April 2016) to I Revision

  • Added Supports 105°C PCB Temperature to Features ListGo
  • Changed Operating Temperature to Ambient Temperature Go
  • Added Junction Temperature of 125 °CGo
  • Added PCB Temperature of 105 °C Go
  • Added TPCB ≤ 105°C throughout Electrical Tables Go

Changes from G Revision (January 2015) to H Revision

  • Changed "Infrared or Convection (20 sec)" from 235 °CGo
  • Added thermal data for SOT23 and SC70 packages Go

Changes from F Revision (April 2013) to G Revision

  • Added, updated, or renamed the following sections: Device Information Table, Pin Configurations and Functions; Specifications; Application and Implementation; Power Supply Recommendations; Layout; Device and Documentation Support; Mechanical, Packaging, and Ordering Information Go
  • Changed from "transient response" to "eliminate possible output chatter" in Circuit Layout and Bypassing Go

Changes from E Revision (March 2013) to F Revision

  • Changed layout of National Data Sheet to TI formatGo