SNOS986E December   2001  – July 2014 LMH6622

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 ±6 V Electrical Characteristics
    6. 6.6 ±2.5 V Electrical Characteristics
    7. 6.7 Typical Performance Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 DSL Receive Channel Applications
    2. 9.2 Receive Channel Noise Calculation
    3. 9.3 Differential Analog-to-Digital Driver
    4. 9.4 Typical Application
      1. 9.4.1 Design Requirements
      2. 9.4.2 Detailed Design Procedure
      3. 9.4.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Driving Capacitive Load
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Circuit Layout Considerations
    2. 11.2 Layout Examples
      1. 11.2.1 SOIC Layout Example
      2. 11.2.2 VSSOP Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from D Revision (March 2013) to E Revision

  • Changed data sheet flow and layout to conform with new TI standards. Added the following sections: Device Information Table, Application and Implementation; Power Supply Recommendations; Layout; Device and Documentation Support; Mechanical, Packaging, and Ordering Information Go
  • Changed RG to RC. Changed AV from +10 to +9 for Figure 38Go
  • Changed RG to RC. Changed AV from +10 to +9 for Figure 39Go

Changes from C Revision (March 2013) to D Revision

  • Changed layout of National Data Sheet to TI formatGo