ZHCSDQ5A April   2015  – May 2015 LMH6401

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Setup Diagrams
    2. 8.2 Output Measurement Reference Points
    3. 8.3 ATE Testing and DC Measurements
    4. 8.4 Frequency Response
    5. 8.5 Distortion
    6. 8.6 Noise Figure
    7. 8.7 Pulse Response, Slew Rate, and Overdrive Recovery
    8. 8.8 Power Down
    9. 8.9 VOCM Frequency Response
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-On Reset (POR)
      2. 9.4.2 Power-Down (PD)
      3. 9.4.3 Thermal Feedback Control
      4. 9.4.4 Gain Control
    5. 9.5 Programming
      1. 9.5.1 Details of the Serial Interface
      2. 9.5.2 Timing Diagrams
    6. 9.6 Register Maps
      1. 9.6.1 Revision ID (address = 0h, Read-Only) [default = 03h]
      2. 9.6.2 Product ID (address = 1h, Read-Only) [default = 00h]
      3. 9.6.3 Gain Control (address = 2h) [default = 20h]
      4. 9.6.4 Reserved (address = 3h) [default = 8Ch]
      5. 9.6.5 Thermal Feedback Gain Control (address = 4h) [default = 27h]
      6. 9.6.6 Thermal Feedback Frequency Control (address = 5h) [default = 45h]
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Analog Input Characteristics
      2. 10.1.2 Analog Output Characteristics
        1. 10.1.2.1 Driving Capacitive Loads
      3. 10.1.3 Thermal Feedback Control
        1. 10.1.3.1 Step Response Optimization using Thermal Feedback Control
      4. 10.1.4 Thermal Considerations
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Driving ADCs
          1. 10.2.2.1.1 SNR Considerations
          2. 10.2.2.1.2 SFDR Considerations
          3. 10.2.2.1.3 ADC Input Common-Mode Voltage Considerations—AC-Coupled Input
          4. 10.2.2.1.4 ADC Input Common-Mode Voltage Considerations—DC-Coupled Input
      3. 10.2.3 Application Curves
    3. 10.3 Do's and Don'ts
      1. 10.3.1 Do:
      2. 10.3.2 Don't:
  11. 11Power-Supply Recommendations
    1. 11.1 Single-Supply Operation
    2. 11.2 Split-Supply Operation
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档　
    2. 13.2 社区资源
    3. 13.3 商标
    4. 13.4 静电放电警告
    5. 13.5 术语表
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Device Options

Table 1. FDA Device Companion

DEVICE BW (AV = 12 dB) DISTORTION NOISE
LMH5401 6.2 GHz –75-dBc HD2, –75-dBc HD3 at 500 MHz 1.25 nV/√Hz
LMH3401 7 GHz, G = 16 dB –79-dBc HD2, –77-dBc HD3 at 500 MHz 1.4 nV/√Hz
LMH6554 1.6 GHz –79-dBc HD2, –70-dBc HD3 at 250 MHz 0.9 nV/√Hz

Table 2. DVGA Device Comparison

DEVICE MAX GAIN, BW DISTORTION NOISE FIGURE
LMH6517 22 dB, 1.2 GHz 43-dBm OIP3 at 200 MHz, –74-dBc HD3 at 200 MHz 5.5 dB
LMH6521 26 dB, 1.2 GHz 49-dBm OIP3 at 200 MHz, –84-dBc HD3 at 200 MHz 7.3 dB
LMH6881 26 dB, 2.4 GHz 42-dBm OIP3 at 200 MHz, –76-dBc HD3 at 200 MHz 9.7 dB