产品详情

Audio input type Analog Input Architecture Class-D Speaker channels (max) Mono Rating Catalog Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.7 Load (min) (Ω) 8 Output power (W) 1.19 THD + N at 1 kHz (%) 0.03 Iq (typ) (mA) 4.5 Control interface I2C Closed/open loop Open Analog supply (min) (V) 2.7 Analog supply voltage (max) (V) 5.5 PSRR (dB) 79 Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-D Speaker channels (max) Mono Rating Catalog Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.7 Load (min) (Ω) 8 Output power (W) 1.19 THD + N at 1 kHz (%) 0.03 Iq (typ) (mA) 4.5 Control interface I2C Closed/open loop Open Analog supply (min) (V) 2.7 Analog supply voltage (max) (V) 5.5 PSRR (dB) 79 Operating temperature range (°C) -40 to 85
DSBGA (YZR) 25 7.5625 mm² 2.75 x 2.75
  • I2C Control Interface
  • I2C Programmable Texas Instruments 3D Audio
  • I2C Controlled 32 Step Digital Volume Control (-59.5dB to +18dB)
  • Three Independent Volume Channels (Left, Right, Mono)
  • Eight Distinct Output Modes
  • Small, 25–Bump DSBGA Packaging
  • “Click and Pop” Suppression Circuitry
  • Thermal Shutdown Protection
  • Low Shutdown Current (0.1μA, typ)
  • RF Suppression
  • Differential Mono and Stereo Inputs
  • Stereo Input Mux

Key Specifications

  • THD+N at 1kHz, 500mW into 8Ω BTL (3.3V): 1.0% (typ)
  • THD+N at 1kHz, 37mW into 32Ω SE (3.3V): 1.0% (typ)
  • Single Supply Operation (VDD): 2.7 to 5.5 V
  • I2C Single Supply Operation: 2.2 to 5.5 V

All trademarks are the property of their respective owners.

  • I2C Control Interface
  • I2C Programmable Texas Instruments 3D Audio
  • I2C Controlled 32 Step Digital Volume Control (-59.5dB to +18dB)
  • Three Independent Volume Channels (Left, Right, Mono)
  • Eight Distinct Output Modes
  • Small, 25–Bump DSBGA Packaging
  • “Click and Pop” Suppression Circuitry
  • Thermal Shutdown Protection
  • Low Shutdown Current (0.1μA, typ)
  • RF Suppression
  • Differential Mono and Stereo Inputs
  • Stereo Input Mux

Key Specifications

  • THD+N at 1kHz, 500mW into 8Ω BTL (3.3V): 1.0% (typ)
  • THD+N at 1kHz, 37mW into 32Ω SE (3.3V): 1.0% (typ)
  • Single Supply Operation (VDD): 2.7 to 5.5 V
  • I2C Single Supply Operation: 2.2 to 5.5 V

All trademarks are the property of their respective owners.

The LM4947 is an audio subsystem capable of efficiently delivering 500mW (Class D operation) of continuous average power into a mono 8Ω bridged-tied load (BTL) with 1% THD+N, 37mW (Class AB operation) power channel of continuous average power into stereo 32Ω single-ended (SE) loads with 1% THD+N, or an output capacitor-less (OCL) configuration with identical specification as the SE configuration, from a 3.3V power supply.

The LM4947 has six input channels: one pair for a two-channel stereo signal, the second pair for a secondary two-channel stereo input, and the third pair for a differential single-channel mono input. Additionally, the two sets of stereo inputs may be configured as a single stereo differential input (differential left and differential right). The LM4947 features a 32-step digital volume control and eight distinct output modes. The digital volume control, 3D enhancement, and output modes are programmed through a two-wire I2C compatible interface that allows flexibility in routing and mixing audio channels.

The RF suppression circuitry in the LM4947 makes it well-suited for GSM mobile phones and other portable applications in which strong RF signals generated by an antenna (and long output traces) may couple audibly into the amplifier.

The LM4947 is designed for cellular phones, PDAs, and other portable handheld applications. It delivers high quality output power from a surface-mount package and requires only eight external components in the OCL mode (two additional components in SE mode).

The LM4947 is an audio subsystem capable of efficiently delivering 500mW (Class D operation) of continuous average power into a mono 8Ω bridged-tied load (BTL) with 1% THD+N, 37mW (Class AB operation) power channel of continuous average power into stereo 32Ω single-ended (SE) loads with 1% THD+N, or an output capacitor-less (OCL) configuration with identical specification as the SE configuration, from a 3.3V power supply.

The LM4947 has six input channels: one pair for a two-channel stereo signal, the second pair for a secondary two-channel stereo input, and the third pair for a differential single-channel mono input. Additionally, the two sets of stereo inputs may be configured as a single stereo differential input (differential left and differential right). The LM4947 features a 32-step digital volume control and eight distinct output modes. The digital volume control, 3D enhancement, and output modes are programmed through a two-wire I2C compatible interface that allows flexibility in routing and mixing audio channels.

The RF suppression circuitry in the LM4947 makes it well-suited for GSM mobile phones and other portable applications in which strong RF signals generated by an antenna (and long output traces) may couple audibly into the amplifier.

The LM4947 is designed for cellular phones, PDAs, and other portable handheld applications. It delivers high quality output power from a surface-mount package and requires only eight external components in the OCL mode (two additional components in SE mode).

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* 数据表 LM4947 Mono Class D & Stereo Audio Sub-Sys w/OCL Hp Amp & TI 3D 数据表 (Rev. D) 2013年 5月 1日

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LM4947TLEVAL — 具有 OCL 耳机放大器和美国国家半导体 3D 的单声道 D 类和立体声音频子系统

The LM4947 is an integrated stereo subsystem with a filterless monoClass D speaker amplifier and selectable output low noise headphone amplifier in a 25-bump micro SMD package. The LM4947 also features RF suppression circuitry and TI 3D enhancement. The LM4947 is designed to meet the demands of (...)

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SNAC026 LM4947 Control Software

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扬声器放大器
LM4947 具有 87mW 耳机放大器和 3D 增强功能的 2.2W 单声道、模拟输入 D 类放大器
硬件开发
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LM4947TLEVAL 具有 OCL 耳机放大器和美国国家半导体 3D 的单声道 D 类和立体声音频子系统
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包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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