产品详情

Rating Catalog Operating temperature range (°C) -40 to 85
Rating Catalog Operating temperature range (°C) -40 to 85
WQFN (RTW) 24 16 mm² 4 x 4

  • I 2 C/SPI Control Interface
  • I 2 C/SPI programmable National 3D Audio
  • I 2 C/SPI controlled 32 step digital volume control (-54dB to +18dB)
  • Three independent volume channels (Left, Right, Mono)
  • Eight distinct output modes
  • LLP and microSMD surface mount packaging
  • “Click and Pop” suppression circuitry
  • Thermal shutdown protection
  • Low shutdown current (0.02uA, typ)
  • RF immunity topology

  • I 2 C/SPI Control Interface
  • I 2 C/SPI programmable National 3D Audio
  • I 2 C/SPI controlled 32 step digital volume control (-54dB to +18dB)
  • Three independent volume channels (Left, Right, Mono)
  • Eight distinct output modes
  • LLP and microSMD surface mount packaging
  • “Click and Pop” suppression circuitry
  • Thermal shutdown protection
  • Low shutdown current (0.02uA, typ)
  • RF immunity topology

  • The LM4946 is an audio power amplifier capable of delivering 540mW of continuous average power into a mono 8Ω bridged-tied load (BTL) with 1% THD+N, 35mW per channel of continuous average power into stereo 32Ω single-ended (SE) loads with 1% THD+N, or an output capacitor-less (OCL) configuration with identical specifications as the SE configuration, from a 3.3V power supply.

    The LM4946 has three input channels: one pair for a two-channel stereo signal and the third for a differential single-channel mono input. The LM4946 features a 32-step digital volume control and eight distinct output modes. The digital volume control, 3D enhancement, and output modes (mono/SE/OCL) are programmed through a two-wire I 2C or a three-wire SPI compatible interface that allows flexibility in routing and mixing audio channels.

    The LM4946 is designed for cellular phone, PDA, and other portable handheld applications. It delivers high quality output power from a surface-mount package and requires only seven external components in the OCL mode (two additional components in SE mode).


    Key Specifications

    THD+N at 1kHz, 540mW into 8Ω BTL (3.3V) 1.0% (typ)
    THD+N at 1kHz, 35mW into 32Ω SE (3.3V) 1.0% (typ)
    Single Supply Operation (VDD) 2.7 to 5.5V
    I 2C/SPI Single Supply Operation  
    LLP 2.2 to 5.5V
    micro SMD 1.7 to 5.5V

    The LM4946 is an audio power amplifier capable of delivering 540mW of continuous average power into a mono 8Ω bridged-tied load (BTL) with 1% THD+N, 35mW per channel of continuous average power into stereo 32Ω single-ended (SE) loads with 1% THD+N, or an output capacitor-less (OCL) configuration with identical specifications as the SE configuration, from a 3.3V power supply.

    The LM4946 has three input channels: one pair for a two-channel stereo signal and the third for a differential single-channel mono input. The LM4946 features a 32-step digital volume control and eight distinct output modes. The digital volume control, 3D enhancement, and output modes (mono/SE/OCL) are programmed through a two-wire I 2C or a three-wire SPI compatible interface that allows flexibility in routing and mixing audio channels.

    The LM4946 is designed for cellular phone, PDA, and other portable handheld applications. It delivers high quality output power from a surface-mount package and requires only seven external components in the OCL mode (two additional components in SE mode).


    Key Specifications

    THD+N at 1kHz, 540mW into 8Ω BTL (3.3V) 1.0% (typ)
    THD+N at 1kHz, 35mW into 32Ω SE (3.3V) 1.0% (typ)
    Single Supply Operation (VDD) 2.7 to 5.5V
    I 2C/SPI Single Supply Operation  
    LLP 2.2 to 5.5V
    micro SMD 1.7 to 5.5V

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    技术文档

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    类型 标题 下载最新的英语版本 日期
    * 数据表 LM4946 Output Capacitor-Less Audio Subsystem with Programmable TI 3D 数据表 (Rev. E) 2007年 8月 1日
    应用手册 AN-1496 Noise, TDMA Noise, and Suppression Techniques (Rev. D) 2013年 5月 1日

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    WQFN (RTW) 24 查看选项

    订购和质量

    包含信息:
    • RoHS
    • REACH
    • 器件标识
    • 引脚镀层/焊球材料
    • MSL 等级/回流焊峰值温度
    • MTBF/时基故障估算
    • 材料成分
    • 鉴定摘要
    • 持续可靠性监测
    包含信息:
    • 制造厂地点
    • 封装厂地点

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