产品详情

Audio input type Analog Input Architecture Class-AB Speaker channels (max) Stereo Rating Catalog Power stage supply (max) (V) 16 Power stage supply (min) (V) 9.6 Load (min) (Ω) 4 Output power (W) 11 THD + N at 1 kHz (%) 0.08 Iq (typ) (mA) 5.25 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 9.6 Analog supply voltage (max) (V) 16 PSRR (dB) 50 Operating temperature range (°C) 0 to 70
Audio input type Analog Input Architecture Class-AB Speaker channels (max) Stereo Rating Catalog Power stage supply (max) (V) 16 Power stage supply (min) (V) 9.6 Load (min) (Ω) 4 Output power (W) 11 THD + N at 1 kHz (%) 0.08 Iq (typ) (mA) 5.25 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 9.6 Analog supply voltage (max) (V) 16 PSRR (dB) 50 Operating temperature range (°C) 0 to 70
TO-263 (KTW) 7 153.924 mm² 10.1 x 15.24
  • Drives 4Ω and 8Ω Loads
  • Internal Gain Resistors (AV = 34 dB)
  • Minimum External Component Requirement
  • Single Supply Operation
  • Internal Current Limiting
  • Internal Thermal Protection
  • Compact 7-lead TO-220 Package
  • Low Cost-Per-Watt
  • Wide Supply Range 9V - 40V

Key Specifications

  • Output Power at 10% THD+N with 1kHz into 4Ω VCC = 24V 11 W (typ)
  • Output Power at 10% THD+N with 1kHz into 8Ω VCC = 24V 7 W (typ)
  • Closed Loop Gain 34 dB (typ)
  • PO at 10% THD+N @ 1 kHz into 4Ω Single-Ended DDPAK Package VCC = 12V 2.5 W (typ)
  • PO at 10% THD+N @ 1kHz into 8Ω Bridged DDPAK Package VCC = 12V 5 W (typ)

All trademarks are the property of their respective owners.

  • Drives 4Ω and 8Ω Loads
  • Internal Gain Resistors (AV = 34 dB)
  • Minimum External Component Requirement
  • Single Supply Operation
  • Internal Current Limiting
  • Internal Thermal Protection
  • Compact 7-lead TO-220 Package
  • Low Cost-Per-Watt
  • Wide Supply Range 9V - 40V

Key Specifications

  • Output Power at 10% THD+N with 1kHz into 4Ω VCC = 24V 11 W (typ)
  • Output Power at 10% THD+N with 1kHz into 8Ω VCC = 24V 7 W (typ)
  • Closed Loop Gain 34 dB (typ)
  • PO at 10% THD+N @ 1 kHz into 4Ω Single-Ended DDPAK Package VCC = 12V 2.5 W (typ)
  • PO at 10% THD+N @ 1kHz into 8Ω Bridged DDPAK Package VCC = 12V 5 W (typ)

All trademarks are the property of their respective owners.

The LM4752 is a stereo audio amplifier capable of delivering 11W per channel of continuous average output power to a 4Ω load, or 7W per channel into 8Ω using a single 24V supply at 10% THD+N.

The LM4752 is specifically designed for single supply operation and a low external component count. The gain and bias resistors are integrated on chip, resulting in a 11W stereo amplifier in a compact 7 pin TO-220 package. High output power levels at both 20V and 24V supplies and low external component count offer high value for compact stereo and TV applications. A simple mute function can be implemented with the addition of a few external components.

The LM4752 is a stereo audio amplifier capable of delivering 11W per channel of continuous average output power to a 4Ω load, or 7W per channel into 8Ω using a single 24V supply at 10% THD+N.

The LM4752 is specifically designed for single supply operation and a low external component count. The gain and bias resistors are integrated on chip, resulting in a 11W stereo amplifier in a compact 7 pin TO-220 package. High output power levels at both 20V and 24V supplies and low external component count offer high value for compact stereo and TV applications. A simple mute function can be implemented with the addition of a few external components.

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类型 标题 下载最新的英语版本 日期
* 数据表 LM4752 Stereo 11W Audio Power Amp 数据表 (Rev. E) 2013年 4月 4日
应用手册 Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) 2019年 8月 26日
应用手册 AN-1849 An Audio Amplifier Power Supply Design (Rev. C) 2019年 6月 27日

设计和开发

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仿真模型

LM4752 TINA-TI Reference Design

SNAM045.TSC (295 KB) - TINA-TI Reference Design
仿真模型

LM4752 TINA-TI Spice Model

SNAM046.ZIP (20 KB) - TINA-TI Spice Model
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TO-263 (KTW) 7 查看选项

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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