ZHCSGJ8B April   2017  – October 2017 LM36010

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化电路原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Flash Mode
      2. 7.3.2 Torch Mode
      3. 7.3.3 IR Mode
    4. 7.4 Device Functioning Modes
      1. 7.4.1 Start-Up (Enabling The Device)
      2. 7.4.2 Pass Mode
      3. 7.4.3 Input Voltage Flash Monitor (IVFM)
      4. 7.4.4 Fault/Protections
        1. 7.4.4.1 Overvoltage Protection (OVP)
        2. 7.4.4.2 Input Voltage Flash Monitor (IVFM)
        3. 7.4.4.3 LED and/or VOUT Short Fault
        4. 7.4.4.4 Current Limit (OCP)
        5. 7.4.4.5 Thermal Scale-Back (TSB)
        6. 7.4.4.6 Thermal Shutdown (TSD)
        7. 7.4.4.7 Undervoltage Lockout (UVLO)
        8. 7.4.4.8 Flash Time-out (FTO)
    5. 7.5 Programming
      1. 7.5.1 Control Truth Table
      2. 7.5.2 I2C-Compatible Interface
        1. 7.5.2.1 Data Validity
        2. 7.5.2.2 Start and Stop Conditions
        3. 7.5.2.3 Transferring Data
        4. 7.5.2.4 I2C-Compatible Chip Address
    6. 7.6 Register Descriptions
      1. 7.6.1 Enable Register (0x01)
      2. 7.6.2 Configuration Register (0x02)
      3. 7.6.3 LED Flash Brightness Register (0x03)
      4. 7.6.4 LED Torch Brightness Register (0x04)
      5. 7.6.5 Flags Register (0x05)
      6. 7.6.6 Device ID and RESET Register (0x06)
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Thermal Performance
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Inductor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YKB|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.2.2.3 Input Capacitor Selection

Choosing the correct size and type of input capacitor helps minimize the voltage ripple caused by the switching of the boost converter and reduces noise on the input pin of the boost converter that can feed through and disrupt internal analog signals. In the typical application circuit a 10-µF ceramic input capacitor works well. It is important to place the input capacitor as close as possible to the LM36010 input (IN) pin. This reduces the series resistance and inductance that can inject noise into the device due to the input switching currents. Table 2 lists various input capacitors recommended for use with the LM36010.

Table 2. Recommended Input/Output Capacitors (X5R/X7R Dielectric)

MANUFACTURERPART NUMBERVALUECASE SIZE VOLTAGE RATING
TDK Corporation C1608JB0J106M 10 µF 0603 (1.6 mm × 0.8 mm × 0.8 mm) 6.3 V
TDK Corporation C2012JB1A106M 10 µF 0805 (2 mm × 1.25 mm × 1.25 mm) 10 V
Murata GRM188R60J106M 10 µF 0603 (1.6 mm × 0.8 mm × 0.8 mm) 6.3 V
Murata GRM21BR61A106KE19 10 µF 0805 (2 mm × 1.25 mm × 1.25 mm) 10 V