SNVS039J June   2000  – April 2015 LM1086

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Ripple Rejection
      2. 7.3.2 Load Regulation
      3. 7.3.3 Overload Recovery
    4. 7.4 Device Functional Modes
      1. 7.4.1 Output Voltage
      2. 7.4.2 Stability Consideration
      3. 7.4.3 Protection Diodes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1  1.2-V to 15-V Adjustable Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2  Adjustable at 5 V
      3. 8.2.3  5-V Regulator with Shutdown
      4. 8.2.4  Battery Charger
      5. 8.2.5  Adjustable Fixed Regulator
      6. 8.2.6  Regulator With Reference
      7. 8.2.7  High Current Lamp Driver Protection
      8. 8.2.8  Battery Backup Regulated Supply
      9. 8.2.9  Ripple Rejection Enhancement
      10. 8.2.10 Automatic Light Control
      11. 8.2.11 Remote Sensing
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Development Support
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)(2)
MIN MAX UNIT
Maximum Input to Output Voltage Differential LM1086-ADJ 29 V
LM1086-1.8 27 V
LM1086-2.5 27 V
LM1086-3.3 27 V
LM1086-5.0 25 V
Power Dissipation(3) Internally Limited
Junction Temperature (TJ)(4) 150 °C
Lead Temperature 260, to 10 sec °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.
(3) Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery in Application and Implementation. The value θJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number SNOA401).
(4) The maximum power dissipation is a function of TJ(MAX) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal Considerations

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN MAX UNIT
JUNCTION TEMPERATURE RANGE (TJ)(1)
 "C" Grade Control Section 0 125 °C
Output Section 0 150 °C
 "I" Grade Control Section −40 125 °C
Output Section −40 150 °C

6.4 Thermal Information

THERMAL METRIC(1) LM1086 UNIT
KTT NDE NGN
3 PINS 3 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 40.8 23.0 35.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 42.3 16.1 24.2
RθJB Junction-to-board thermal resistance 23.3 4.5 13.2
ψJT Junction-to-top characterization parameter 10.2 2.4 0.2
ψJB Junction-to-board characterization parameter 22.3 2.5 13.3
RθJC(bot) Junction-to-case (bottom) thermal resistance: Control Section/Output Section 1.5/4.0 1.5/4.0 2.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Typicals and limits appearing in normal type apply for TJ = 25°C unless specified otherwise.
PARAMETER TEST CONDITIONS TJ = 25°C TJ over the entire range for operation (see Recommended Operating Conditions) UNIT
MIN TYP MAX MIN(3) TYP(2) MAX (3)
VREF Reference Voltage LM1086-ADJ, IOUT = 10 mA, VIN − VOUT = 3 V, 10 mA ≤ IOUT ≤ IFULL LOAD, 1.5 V ≤ VIN − VOUT ≤ 15 V(4) 1.238 1.250 1.262 1.225 1.250 1.270 V
VOUT Output Voltage(4) LM1086-1.8, IOUT = 0 mA, VIN = 5 V, 0 ≤ IOUT ≤ IFULL LOAD, 3.3 V ≤ VIN ≤ 18 V 1.782 1.8 1.818 1.764 1.8 1.836 V
LM1086-2.5, IOUT = 0 mA, VIN = 5 V, 0 ≤ IOUT ≤ IFULL LOAD, 4.0 V ≤ VIN ≤ 18 V 2.475 2.50 2.525 2.450 2.50 2.55 V
LM1086-3.3, IOUT = 0 mA, VIN = 5 V, 0 ≤ IOUT ≤ IFULL LOAD, 4.75 V ≤ VIN ≤ 18 V 3.267 3.300 3.333 3.235 3.300 3.365 V
LM1086-5.0, IOUT = 0 mA, VIN = 8 V, 0 ≤ IOUT ≤ IFULL LOAD, 6.5 V ≤ VIN ≤ 20 V 4.950 5.000 5.050 4.900 5.000 5.100 V
ΔVOUT Line Regulation(5) LM1086-ADJ, IOUT =10 mA, 1.5 V ≤ (VIN - VOUT) ≤ 15 V 0.015% 0.2% 0.035% 0.2%
LM1086-1.8, IOUT = 0 mA, 3.3 V ≤ VIN ≤ 18 V 0.3 6 0.6 6 mV
LM1086-2.5, IOUT = 0 mA, 4.0 V ≤ VIN ≤ 18 V 0.3 6 0.6 6 mV
LM1086-3.3, IOUT = 0 mA, 4.5 V ≤ VIN ≤ 18 V 0.5 10 1.0 10 mV
LM1086-5.0, IOUT = 0 mA, 6.5 V ≤ VIN ≤ 20 V 0.5 10 1.0 10 mV
ΔVOUT Load Regulation(5) LM1086-ADJ, (VIN-V OUT ) = 3 V, 10 mA ≤ IOUT ≤ IFULL LOAD 0.1% 0.3% 0.2% 0.4%
LM1086-1.8, 2.5, VIN = 5 V, 0 ≤ IOUT ≤ IFULL LOAD 3 12 6 20 mV
LM1086-3.3, VIN = 5 V, 0 ≤ IOUT ≤ IFULL LOAD 3 15 7 25 mV
LM1086-5.0, VIN = 8 V, 0 ≤ IOUT ≤ IFULL LOAD 5 20 10 35 mV
Dropout Voltage(6) LM1086-ADJ, 1.8, 2.5, 3.3, 5, ΔVREF, ΔVOUT = 1%, IOUT = 1.5A 1.3 1.5 V
ILIMIT Current Limit LM1086-ADJ, VIN − VOUT = 5 V, VIN − VOUT = 25 V 1.50 2.7 A
0.05 0.15
LM1086-1.8,2.5, 3.3, VIN = 8 V 1.5 2.7 A
LM1086-5.0, VIN = 10 V 1.5 2.7 A
Minimum Load Current(7) LM1086-ADJ, VIN −VOUT = 25 V 5.0 10.0 mA
Quiescent Current LM1086-1.8, 2.5, VIN ≤ 18 V 5.0 10.0 mA
LM1086-3.3, VIN ≤ 18 V 5.0 10.0 mA
LM1086-5.0, VIN ≤ 20 V 5.0 10.0 mA
Thermal Regulation TA = 25°C, 30ms Pulse 0.008 0.04 %/W
Ripple Rejection fRIPPLE = 120 Hz, COUT = 25 µF Tantalum, IOUT = 1.5 A 60 75 dB
LM1086-ADJ, CADJ = 25 µF, (VIN− VO) = 3 V
LM1086-1.8, 2.5, VIN = 6 V 60 72 dB
LM1086-3.3, VIN= 6.3 V 60 72 dB
LM1086-5.0 VIN = 8 V 60 68 dB
Adjust Pin Current LM1086 55 120 µA
Adjust Pin Current Change 10 mA ≤ IOUT ≤ IFULL LOAD, 1.5 V ≤ (VIN−VOUT) ≤ 15 V 0.2 5 µA
Temperature Stability 0.5%
Long Term Stability TA = 125°C, 1000 Hrs 0.3% 1.0%
RMS Noise
(% of VOUT)		 10 Hz ≤ f≤ 10 kHz 0.003%
(1) The maximum power dissipation is a function of TJ(MAX) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal Considerations.
(2) Typical Values represent the most likely parametric norm.
(3) All limits are specified by testing or statistical analysis.
(4) IFULL LOAD is defined in the current limit curves. The IFULL LOAD Curve defines current limit as a function of input-to-output voltage. Note that 15W power dissipation for the LM1086 is only achievable over a limited range of input-to-output voltage.
(5) Load and line regulation are measured at constant junction temperature, and are specified up to the maximum power dissipation of 15W. Power dissipation is determined by the input/output differential and the output current. Ensured maximum power dissipation will not be available over the full input/output range.
(6) Dropout voltage is specified over the full output current range of the device.
(7) The minimum output current required to maintain regulation.

6.6 Typical Characteristics

LM1086 10094863.png
Figure 1. Dropout Voltage vs Output Current
LM1086 10094838.png
Figure 3. Load Regulation vs Temperature
LM1086 10094898.png
Figure 5. Adjust Pin Current vs Temperature
LM1086 10094843.png
Figure 7. Ripple Rejection vs Frequency (LM1086-ADJ)
LM1086 10094845.png
Figure 9. Ripple Rejection vs Frequency (LM1086-5)
LM1086 10094847.png
Figure 11. Line Transient Response
LM1086 10094837.png
Figure 2. Short-Circuit Current vs Input/Output Difference
LM1086 10094899.png
Figure 4. Percent Change in Output Voltage vs Temperature
LM1086 10094842.png
Figure 6. Maximum Power Dissipation vs Temperature
LM1086 10094844.png
Figure 8. Ripple Rejection vs Output Current (LM1086-ADJ)
LM1086 10094846.png
Figure 10. Ripple Rejection vs Output Current (LM1086-5)
LM1086 10094848.png
Figure 12. Load Transient Response