ZHCSGB6A May   2017  – June 2017 INA826S

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Inside the INA826S
      2. 7.3.2 Setting the Gain
        1. 7.3.2.1 Gain Drift
      3. 7.3.3 Offset Trimming
      4. 7.3.4 Input Common-Mode Range
      5. 7.3.5 Input Protection
      6. 7.3.6 Input Bias Current Return Path
      7. 7.3.7 Reference Pin (REF)
      8. 7.3.8 Shutdown (EN and ENREF) Pins
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 Low-Voltage Operation
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Configuration and Functions

DRC Package
10-Pin VSON
Top View

Pin Functions

NAME NO. I/O DESCRIPTION
EN 5 I Enable pin; active low with respect to ENREF
ENREF 6 I Enable pin reference
–IN 1 I Negative (inverting) input
+IN 4 I Positive (noninverting) input
OUT 9 O Output
REF 8 I Reference input. This pin must be driven by low impedance.
RG 2, 3 Gain setting pins. Place a gain resistor between pin 2 and pin 3.
–VS 7 Negative supply
+VS 10 Positive supply
Thermal pad Pad Exposed thermal die pad on underside; connect thermal die pad to V–.
Soldering the thermal pad improves heat dissipation and provides specified performance.