DS90LV028A 3V LVDS 双路 CMOS 差动线路接收器 | 德州仪器 TI.com.cn

DS90LV028A (正在供货)

3V LVDS 双路 CMOS 差动线路接收器

3V LVDS 双路 CMOS 差动线路接收器 - DS90LV028A
数据表
 

备选器件推荐

  • DS90LV027A  -  Companion dual high speed LVDS driver
  • DS90LV048A  -  Higher Channel Count
  • DS90LV032A  - 器件与被比较器件具有相似功能,但并不功能等效。 

描述

The DS90LV028A is a dual CMOS differential line receiver designed for applications requiring ultra low power dissipation, low noise and high data rates. The device is designed to support data rates in excess of 400-Mbps (200 MHz) utilizing Low Voltage Differential Signaling (LVDS) technology.

The DS90LV028A accepts low voltage (350 mV typical) differential input signals and translates them to 3-V CMOS output levels. The receiver also supports open, shorted and terminated (100 Ω) input fail-safe. The receiver output is HIGH for all fail-safe conditions. The DS90LV028A has a flow-through design for easy PCB layout.

The DS90LV028A and companion LVDS line driver provide a new alternative to high power PECL/ECL devices for high speed point-to-point interface applications.

特性

  • >400-Mbps (200 MHz) Switching Rates
  • 50-ps Differential Skew (Typical)
  • 0.1-ns Channel-to-Channel Skew (Typical)
  • 2.5-ns Maximum Propagation Delay
  • 3.3-V Power Supply Design
  • Flow-Through Pinout
  • Power Down High Impedance on LVDS Inputs
  • Low Power Design (18 mW at 3.3-V static)
  • Interoperable with Existing 5-V LVDS Networks
  • Accepts Small Swing (350 mV Typical) Differential
    Signal Levels
  • Supports Open, Short and Terminated Input Fail-
    Safe
  • Conforms to ANSI/TIA/EIA-644 Standard
  • Industrial Temperature Operating Range: –40°C
    to 85°C
  • Available in SOIC and Space Saving WSON
    Package

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参数 与其它产品相比 缓冲器、驱动器/接收器和交叉点

 
Device Type
Protocols
No. of Tx
No. of Rx
Input Signal
Output Signal
Signaling Rate (Mbps)
ESD HBM (kV)
Function
Operating Temperature Range (C)
Package Group
Package Size: mm2:W x L (PKG)
Pin/Package
DS90LV028A DS90LV012A DS90LV028AQ-Q1 DS90LV032A DS90LV048A SN65LVDS2 SN65LVDS349 SN65LVDS9637
Receiver     Receiver     Receiver     Receiver     Receiver     Receiver     Receiver     Receiver    
LVDS     M-LVDS     LVDS     LVDS     LVDS     LVDS     LVDS     LVDS    
0     0     0     0     0     0     0     0    
2     1     2     4     4     1     4     2    
LVDS     LVDS
BLVDS
LVPECL    
LVDS     LVDS     LVDS     LVDS     CMOS
ECL
LVCMOS
LVDS
LVECL
LVPECL
PECL    
LVDS    
TTL
LVTTL    
CMOS     TTL
LVTTL    
LVCMOS     TTL
LVTTL    
LVTTL     LVTTL     LVTTL    
400     400     400     400     400     400     560     150    
7     2     8     4.5     10     9     15     8    
Receiver     Receiver     Receiver     Receiver     Receiver     Receiver     Receiver     Receiver    
-40 to 85     -40 to 85     -40 to 125     -40 to 85     -40 to 85     -40 to 85     -40 to 85     -40 to 85    
SOIC
WSON    
SOT-23     SOIC     SOIC
TSSOP    
SOIC
TSSOP    
SOIC
SOT-23    
TSSOP     MSOP-PowerPAD
SOIC
VSSOP    
8SOIC: 29 mm2: 6 x 4.9(SOIC)
See datasheet (WSON)    
5SOT-23: 8 mm2: 2.8 x 2.9(SOT-23)     8SOIC: 29 mm2: 6 x 4.9(SOIC)     16SOIC: 59 mm2: 6 x 9.9(SOIC)
16TSSOP: 32 mm2: 6.4 x 5(TSSOP)    
16SOIC: 59 mm2: 6 x 9.9(SOIC)
16TSSOP: 32 mm2: 6.4 x 5(TSSOP)    
8SOIC: 29 mm2: 6 x 4.9(SOIC)
5SOT-23: 8 mm2: 2.8 x 2.9(SOT-23)    
16TSSOP: 32 mm2: 6.4 x 5(TSSOP)     8MSOP-PowerPAD: 15 mm2: 4.9 x 3(MSOP-PowerPAD)
8SOIC: 29 mm2: 6 x 4.9(SOIC)
8VSSOP: 15 mm2: 4.9 x 3(VSSOP)    
8SOIC
8WSON    
5SOT-23     8SOIC     16SOIC
16TSSOP    
16SOIC
16TSSOP    
5SOT-23
8SOIC    
16TSSOP     8MSOP-PowerPAD
8SOIC
8VSSOP    

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