1 Features

• >600-Mbps (300 MHz) Switching Rates
• 0.3-ns Typical Differential Skew
• 0.7-ns Maximum Differential Skew
• 1.5-ns Maximum Propagation Delay
• 3.3-V Power Supply Design
• ±360-mV Differential Signaling
• Low Power Dissipation (46 mW at 3.3-V Static)
• Flow-Through Design Simplifies PCB Layout
• Interoperable With Existing 5-V LVDS Devices
• Power-Off Protection (Outputs in High Impedance)
• Conforms to TIA/EIA-644 Standard
• 8-Pin SOIC Package Saves Space
• Industrial Temperature Operating Range: −40°C to 85°C

2 Applications

• Multi-Function Printers
• LVCMOS-to-LVDS Translation
• Building and Factory Automation
• Grid Infrastructure

3 Description

The DS90LV027A is a dual LVDS driver device optimized for high data rate and low-power applications. The device is designed to support data rates in excess of 600 Mbps (300 MHz) using Low Voltage Differential Signaling (LVDS) technology. The DS90LV027A is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized.

The device is in a 8-pin SOIC package. The DS90LV027A has a flow-through design for easy printed-circuit board (PCB) layout. The differential driver outputs provides low EMI with its typical low output swing of 360 mV. It is perfect for high-speed transfer of clock and data. The DS90LV027A can be paired with its companion dual line receiver, the DS90LV028A, or with any of TI's LVDS receivers, to provide a high-speed point-to-point LVDS interface.

1. For all available packages, see the orderable addendum at the end of the data sheet.

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Functional Diagrams