ZHCSBM8C September   2013  – October 2014 DRV8860

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 简化电路原理图
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Recommended Output Current
      2. 8.3.2 Daisy Chain Connection
      3. 8.3.3 Protection Circuits
        1. 8.3.3.1 Overcurrent Protection (OCP)
        2. 8.3.3.2 Open Load Detection (OL)
        3. 8.3.3.3 Thermal Shutdown (TSD)
        4. 8.3.3.4 Undervoltage Lockout (UVLO)
        5. 8.3.3.5 Digital Noise Filter
    4. 8.4 Device Functional Modes
      1. 8.4.1 Internal Registers
    5. 8.5 Programming
      1. 8.5.1 Serial Control Interface
        1. 8.5.1.1 Data Writing Waveform
        2. 8.5.1.2 Fault Register Reading Waveform
        3. 8.5.1.3 Special Command
          1. 8.5.1.3.1 Special command: Write Control Register
          2. 8.5.1.3.2 Special command: Read Control Register
          3. 8.5.1.3.3 Special command: Read Data Register
          4. 8.5.1.3.4 Special command: Fault Register Reset
          5. 8.5.1.3.5 Special command: PWM Start
        4. 8.5.1.4 Output Energizing and PWM Control
          1. 8.5.1.4.1 PWM Start Special Command Used
    6. 8.6 Register Maps
      1. 8.6.1 Data Register
      2. 8.6.2 Fault Register
      3. 8.6.3 Control Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Drive Current
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply and Logic Sequencing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Consideration
      1. 11.3.1 Power Dissipation
      2. 11.3.2 Heatsinking
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 商标

PowerPAD is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.2 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

12.3 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、首字母缩略词和定义。