ZHCSGQ9 September   2017 CSD87503Q3E

PRODUCTION DATA.  

  1. 1特性
  2. 2应用
  3. 3说明
    1.     顶视图
    2.     电路图像
    3.     RDD(on) 与 VGS 之间的关系
  4. 4修订历史记录
  5. 5 Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6器件和文档支持
    1. 6.1 接收文档更新通知
    2. 6.2 社区资源
    3. 6.3 商标
    4. 6.4 静电放电警告
    5. 6.5 Glossary
  7. 7机械、封装和可订购信息
    1. 7.1 Q3 封装尺寸
    2. 7.2 建议 PCB 布局
    3. 7.3 建议模板开口

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Electrical Characteristics

TA = 25°C (unless otherwise stated)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
STATIC CHARACTERISTICS
BVDSS Drain-to-source voltage(1) VGS = 0 V, ID = 250 μA 30 V
IDSS Drain-to-source leakage current(1) VGS = 0 V, VDS = 24 V 1 μA
IGSS Gate-to-source leakage current(1) VDS = 0 V, VGS = 20 V 100 nA
VGS(th) Gate-to-source threshold voltage(1) VDS = VGS, ID = 250 μA 1.3 1.7 2.1 V
RDD(on) Drain-to-drain on-resistance VGS = 4.5 V, ID1D2 = 6 A 17.3 21.9
VGS = 10 V, ID1D2 = 6 A 13.5 16.9
gfs Transconductance VDS = 3 V, ID1D2 = 6 A 24 S
DYNAMIC CHARACTERISTICS
CISS Input capacitance VGS = 0 V, VD1D2 = 15 V, ƒ = 1 MHz 782 1020 pF
COSS Output capacitance 157 204 pF
CRSS Reverse transfer capacitance 149 194 pF
Rg Series gate resistance(1) 1.5 3.0 Ω
Qg Gate charge total (4.5 V) VD1D2 = 15 V, ID1D2 = 6 A 13.4 17.4 nC
Gate charge total (10 V) 32.9 42.8
Qgd Gate charge gate-to-drain 5.8 nC
Qgs Gate charge gate-to-source 4.8 nC
Qg(th) Gate charge at Vth 1.0 nC
QOSS Output charge VD1D2 = 15 V, VGS = 0 V 4.3 nC
td(on) Turnon delay time VD1D2 = 15 V, VGS = 10 V, ID1D2 = 6 A,
RG = 0 Ω
10 ns
tr Rise time 40 ns
td(off) Turnoff delay time 25 ns
tf Fall time 8 ns
DIODE CHARACTERISTICS
VSD Diode forward voltage(1) ID = 0.5 A, VGS = 0 V 0.75 0.95 V
Qrr Reverse recovery charge(1) VDS = 15 V, IF = 6 A, di/dt = 300 A/μs 9.2 nC
trr Reverse recovery time(1) 14 ns
Parameter measured on both MOSFETs individually. Table values are for a single FET.