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微控制器 (MCU) 和处理器
数字信号处理器 (DSP)

CP3SP33

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具有缓存、DSP、蓝牙、USB、双路 CAN 接口的处理器

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CP3SP33

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产品详情

Rating Catalog Operating temperature range (°C) -40 to 85
Rating Catalog Operating temperature range (°C) -40 to 85
NFBGA (NZN) 224 169 mm² 13 x 13
  • CPU Features
    • Fully static RISC processor core,
      capable of operating from 0 to 96 MHz
      with zero wait/hold state
    • Minimum 10.4 ns instruction cycle time
      with a 96-MHz internal clock frequency,
      based on a 12-MHz external input
    • 4K-byte, 4-way set-associative
      instruction cache
    • 69 independently vectored peripheral
      interrupts
  • DSP Features
    • Capable of operating up to 96 MHz
    • 16-bit fixed-point arithmetic, dual-MAC
      architecture
    • 32-bit interface to 4K-byte RAM shared with
      CPU
    • 32-bit external bus interface
    • Bus master interface to audio peripherals
      and I/O
  • Memory
    • 4K bytes CPU instructioncache
    • 32K bytes CPU data RAM
    • 4K bytes CPU/DSP shared RAM
    • 24K bytes DSP program RAM
    • 24K bytes DSP data RAM
    • 8K bytes Bluetooth sequencer and data RAM
    • Addresses up to 96M bytes (FBGA-224 package)
      or 8M bytes (FBGA-144 package) of external
      memory
  • Broad Range of Hardware Communications Peripherals
    • Bluetooth Lower Link Controller (LLC)
      including a shared 7K byte Bluetooth data
      RAM and 1K byte Bluetooth Sequencer RAM
    • Universal Serial Bus (USB) 2.0 On-The-Go
    • Audio/telematics codec with dual ADC inputs
      and high quality stereo DAC output
    • Two CAN interfaces with 15 message buffers
      conforming to CAN specification 2.0B active
    • Two ACCESS.bus serial bus interfaces (I2C compatible)
    • Two 8/16-bit SPI, Microwire/Plus serial interfaces
    • I2S digital audio bus interface
    • Four Universal Asynchronous Receiver/Transmitter (UART)
      channels, one channel has USART capability
    • Advanced Audio Interface (AAI) to connect to external
      8/ 13-bit PCM Codecs as well as to ISDN-Controllers
      through the IOM-2 interface (slave only)
    • Two CVSD/PCM converters, for supporting two bidirectional
      audio connections
  • External Bus Interface Shared Between CPU and DSP
    • 16/32-bit data busbus interface
    • 23-bit address bus
    • 3 programmable chip select outputs
    • Up to 96M bytes external memory
    • 8-level write buffer
  • General-Purpose Hardware Peripherals
    • 10-channel, 10-bit A/D Converter (ADC)
    • 16-channel DMA controller
    • Dual 16-bit Multi-Function Timer (MFT)
    • Dual Versatile Timer Units (VTU), each with four
      independent timers
    • Timing and Watchdog Unit
  • Extensive Power and Clock Management Support
    • Two Phase Locked Loops (PLL) for synthesizing independent
      system and audio peripheral clocks
    • Two independent oscillators for Active mode
      (12 MHz) and Power Save mode (32.768 kHz) clocks
    • Low-power modes (Power Save, Idle, and Halt) for
      slowing or stopping clocks to optimize power
      consumption while meeting application needs
  • Flexible I/O
    • Up to 64 general-purpose I/O pins (shared with on-chip
      peripheral I/O)
    • Programmable I/O pin characteristics: TRI-STATE output,
      push-pull output, weak pullup/pulldown input, high
      impedance input, high-speed drive capability
    • Schmitt triggers on general-purpose inputs
    • Multi-Input Wake-Up (MIWU) capability…
  • Power Supply
    • I/O port operation at 3.0–3.3V
    • Core logic operation at 1.8V
    • On-chip power-on reset
  • Temperature Range
    • –40°C to +85°C (Industrial)
  • Packages
    • FBGA-224, FBGA-144
  • Complete Development Environment
    • Pre-integrated hardware and software support for
      rapid prototyping and production
    • Multi-file C source editor, source debugger,
      and project manager
    • Comprehensive, integrated, one-stop technical support
  • Bluetooth Protocol Stack
    • Applications can interface to the high-level
      protocols or directly to the low-level Host
      Controller Interface (HCI)
    • Transport layer support allows HCI command-based
      interface over UART port
    • Baseband (Link Controller) hardware minimizes
      the bandwidth demand on the CPU
    • Link Manager (LM)
    • Logical Link Control and Adaptation Protocol
      (L2CAP)
    • Service Discovery Protocol (SDP)
    • RFCOMM Serial Port Emulation Protocol
    • All packet types, piconet, and scatternet
      functionality
  • CPU Features
    • Fully static RISC processor core,
      capable of operating from 0 to 96 MHz
      with zero wait/hold state
    • Minimum 10.4 ns instruction cycle time
      with a 96-MHz internal clock frequency,
      based on a 12-MHz external input
    • 4K-byte, 4-way set-associative
      instruction cache
    • 69 independently vectored peripheral
      interrupts
  • DSP Features
    • Capable of operating up to 96 MHz
    • 16-bit fixed-point arithmetic, dual-MAC
      architecture
    • 32-bit interface to 4K-byte RAM shared with
      CPU
    • 32-bit external bus interface
    • Bus master interface to audio peripherals
      and I/O
  • Memory
    • 4K bytes CPU instructioncache
    • 32K bytes CPU data RAM
    • 4K bytes CPU/DSP shared RAM
    • 24K bytes DSP program RAM
    • 24K bytes DSP data RAM
    • 8K bytes Bluetooth sequencer and data RAM
    • Addresses up to 96M bytes (FBGA-224 package)
      or 8M bytes (FBGA-144 package) of external
      memory
  • Broad Range of Hardware Communications Peripherals
    • Bluetooth Lower Link Controller (LLC)
      including a shared 7K byte Bluetooth data
      RAM and 1K byte Bluetooth Sequencer RAM
    • Universal Serial Bus (USB) 2.0 On-The-Go
    • Audio/telematics codec with dual ADC inputs
      and high quality stereo DAC output
    • Two CAN interfaces with 15 message buffers
      conforming to CAN specification 2.0B active
    • Two ACCESS.bus serial bus interfaces (I2C compatible)
    • Two 8/16-bit SPI, Microwire/Plus serial interfaces
    • I2S digital audio bus interface
    • Four Universal Asynchronous Receiver/Transmitter (UART)
      channels, one channel has USART capability
    • Advanced Audio Interface (AAI) to connect to external
      8/ 13-bit PCM Codecs as well as to ISDN-Controllers
      through the IOM-2 interface (slave only)
    • Two CVSD/PCM converters, for supporting two bidirectional
      audio connections
  • External Bus Interface Shared Between CPU and DSP
    • 16/32-bit data busbus interface
    • 23-bit address bus
    • 3 programmable chip select outputs
    • Up to 96M bytes external memory
    • 8-level write buffer
  • General-Purpose Hardware Peripherals
    • 10-channel, 10-bit A/D Converter (ADC)
    • 16-channel DMA controller
    • Dual 16-bit Multi-Function Timer (MFT)
    • Dual Versatile Timer Units (VTU), each with four
      independent timers
    • Timing and Watchdog Unit
  • Extensive Power and Clock Management Support
    • Two Phase Locked Loops (PLL) for synthesizing independent
      system and audio peripheral clocks
    • Two independent oscillators for Active mode
      (12 MHz) and Power Save mode (32.768 kHz) clocks
    • Low-power modes (Power Save, Idle, and Halt) for
      slowing or stopping clocks to optimize power
      consumption while meeting application needs
  • Flexible I/O
    • Up to 64 general-purpose I/O pins (shared with on-chip
      peripheral I/O)
    • Programmable I/O pin characteristics: TRI-STATE output,
      push-pull output, weak pullup/pulldown input, high
      impedance input, high-speed drive capability
    • Schmitt triggers on general-purpose inputs
    • Multi-Input Wake-Up (MIWU) capability…
  • Power Supply
    • I/O port operation at 3.0–3.3V
    • Core logic operation at 1.8V
    • On-chip power-on reset
  • Temperature Range
    • –40°C to +85°C (Industrial)
  • Packages
    • FBGA-224, FBGA-144
  • Complete Development Environment
    • Pre-integrated hardware and software support for
      rapid prototyping and production
    • Multi-file C source editor, source debugger,
      and project manager
    • Comprehensive, integrated, one-stop technical support
  • Bluetooth Protocol Stack
    • Applications can interface to the high-level
      protocols or directly to the low-level Host
      Controller Interface (HCI)
    • Transport layer support allows HCI command-based
      interface over UART port
    • Baseband (Link Controller) hardware minimizes
      the bandwidth demand on the CPU
    • Link Manager (LM)
    • Logical Link Control and Adaptation Protocol
      (L2CAP)
    • Service Discovery Protocol (SDP)
    • RFCOMM Serial Port Emulation Protocol
    • All packet types, piconet, and scatternet
      functionality

The CP3SP33 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with 4Kbyte instruction cache and a Teak® DSP coprocessor provides high computing bandwidth, DMA-driven hardware communications peripherals provide high I/O bandwidth, and an external bus provides system expandability.

On-chip communications peripherals include: Bluetooth Lower Link Controller, Universal Serial Bus (2.0) OTG node and host controller, dual CAN, dual Microwire/Plus/SPI, dual ACCESS.bus, quad UART, 10-bit A/D converter, and telematics/audio codec. Additional on-chip peripherals include DMA controller, dual CVSD/PCM conversion module, I2S and AAI digital audio bus interfaces, Timing and Watchdog Unit, dual Versatile Timer Unit, dual Multi-Function Timer, and Multi-Input Wake-Up (MIWU) unit.

In addition to providing the features needed for the next generation of embedded Bluetooth products, the CP3SP33 is backed up by the software resources that designers need for rapid time-to-market, including an operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an integrated development environment. Combined with an external program memory and a Bluetooth radio transceiver such as National’s LMX5252, the CP3SP33 provides a complete Bluetooth system solution.

National Semiconductor offers a complete and industry proven application development environment for CP3SP33 applications, including the IAR Embedded Workbench, iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth Development Board, Bluetooth protocol stack, and application examples.

The CP3SP33 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with 4Kbyte instruction cache and a Teak® DSP coprocessor provides high computing bandwidth, DMA-driven hardware communications peripherals provide high I/O bandwidth, and an external bus provides system expandability.

On-chip communications peripherals include: Bluetooth Lower Link Controller, Universal Serial Bus (2.0) OTG node and host controller, dual CAN, dual Microwire/Plus/SPI, dual ACCESS.bus, quad UART, 10-bit A/D converter, and telematics/audio codec. Additional on-chip peripherals include DMA controller, dual CVSD/PCM conversion module, I2S and AAI digital audio bus interfaces, Timing and Watchdog Unit, dual Versatile Timer Unit, dual Multi-Function Timer, and Multi-Input Wake-Up (MIWU) unit.

In addition to providing the features needed for the next generation of embedded Bluetooth products, the CP3SP33 is backed up by the software resources that designers need for rapid time-to-market, including an operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an integrated development environment. Combined with an external program memory and a Bluetooth radio transceiver such as National’s LMX5252, the CP3SP33 provides a complete Bluetooth system solution.

National Semiconductor offers a complete and industry proven application development environment for CP3SP33 applications, including the IAR Embedded Workbench, iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth Development Board, Bluetooth protocol stack, and application examples.
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类型 标题 下载最新的英语版本 日期
* 数据表 CP3SP33 Processor w Cache, DSP,Bluetooth, USB, Dual CAN Interface 数据表 2013年 4月 17日

设计和开发

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IDE、配置、编译器或调试器

CCSTUDIO — Code Composer Studio 集成式开发环境 (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

支持的产品和硬件

支持的产品和硬件

此设计资源支持这些类别中的大部分产品。

查看产品详情页，验证是否能提供支持。
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订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

支持和培训

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