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CD74FCT245

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具有三态输出的 BiCMOS FCT 接口逻辑八路同向总线收发器

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CD74FCT245

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产品详情

Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Number of channels 8 IOL (max) (mA) 64 IOH (max) (mA) -15 Input type TTL Output type TTL Features Very high speed (tpd 5-10ns) Technology family FCT Rating Catalog Operating temperature range (°C) 0 to 70
Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Number of channels 8 IOL (max) (mA) 64 IOH (max) (mA) -15 Input type TTL Output type TTL Features Very high speed (tpd 5-10ns) Technology family FCT Rating Catalog Operating temperature range (°C) 0 to 70
PDIP (N) 20 228.702 mm² 24.33 x 9.4 SOIC (DW) 20 131.84 mm² 12.8 x 10.3
  • BiCMOS Technology With Low Quiescent Power
  • Buffered Inputs
  • Noninverted Outputs
  • Input/Output Isolation From VCC
  • Controlled Output Edge Rates
  • 64-mA Output Sink Current
  • Output Voltage Swing Limited to 3.7 V
  • SCR Latch-Up-Resistant BiCMOS Process and Circuit Design
  • Package Options Include Plastic Small-Outline (M) and Shrink Small-Outline (SM) Packages and Standard Plastic (E) DIP
  • BiCMOS Technology With Low Quiescent Power
  • Buffered Inputs
  • Noninverted Outputs
  • Input/Output Isolation From VCC
  • Controlled Output Edge Rates
  • 64-mA Output Sink Current
  • Output Voltage Swing Limited to 3.7 V
  • SCR Latch-Up-Resistant BiCMOS Process and Circuit Design
  • Package Options Include Plastic Small-Outline (M) and Shrink Small-Outline (SM) Packages and Standard Plastic (E) DIP

The CD74FCT245 is an octal bus transceiver with 3-state outputs using a small-geometry BiCMOS technology. The output stages are a combination of bipolar and CMOS transistors that limit the output high level to two diode drops below VCC. This resultant lowering of output swing (0 V to 3.7 V) reduces the power-bus ringing [a source of electromagnetic interference (EMI)] and minimizes VCC bounce and ground bounce and their effects during simultaneous output switching. The output configuration also enhances switching speed and is capable of sinking 64 mA.

The CD74FCT245 allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending upon the logic level at the direction-control (DIR) input. The output-enable (OE\) input can be used to disable the device so that the buses are effectively isolated.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The CD74FCT245 is characterized for operation from 0°C to 70°C.

The CD74FCT245 is an octal bus transceiver with 3-state outputs using a small-geometry BiCMOS technology. The output stages are a combination of bipolar and CMOS transistors that limit the output high level to two diode drops below VCC. This resultant lowering of output swing (0 V to 3.7 V) reduces the power-bus ringing [a source of electromagnetic interference (EMI)] and minimizes VCC bounce and ground bounce and their effects during simultaneous output switching. The output configuration also enhances switching speed and is capable of sinking 64 mA.

The CD74FCT245 allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending upon the logic level at the direction-control (DIR) input. The output-enable (OE\) input can be used to disable the device so that the buses are effectively isolated.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The CD74FCT245 is characterized for operation from 0°C to 70°C.

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类型 标题 下载最新的英语版本 日期
* 数据表 BiCMOS Octal Bus Transceiver With 3-State Outputs 数据表 2000年 7月 2日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
选择指南 《高级总线接口逻辑器件选择指南》 英语版 2010年 7月 7日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 选择正确的电平转换解决方案 (Rev. A) 英语版 (Rev.A) 2006年 3月 23日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日

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用户指南: PDF | HTML
英语版 (Rev.B): PDF | HTML
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SOIC (DW) 20 查看选项
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订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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