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CD4093B-Q1

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具有施密特触发输入的汽车类 4 通道、2 输入、3V 至 18V 与非门

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CD4093B-Q1

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产品详情

Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 6.8 IOH (max) (mA) -6.8 Input type Schmitt-Trigger Output type Push-Pull Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 8 Rating Automotive Operating temperature range (°C) -40 to 125
Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 6.8 IOH (max) (mA) -6.8 Input type Schmitt-Trigger Output type Push-Pull Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 8 Rating Automotive Operating temperature range (°C) -40 to 125
SOIC (D) 14 51.9 mm² 8.65 x 6
  • Qualified for Automotive Applications
  • Schmitt-Trigger Action on Each Input With No External Components
  • Hysteresis Voltage Typically 0.9 V at VDD = 5 V and 2.3 V at VDD = 10 V
  • Noise Immunity Greater Than 50%
  • No Limit on Input Rise and Fall Times
  • Standardized, Symmetrical Output Characteristics
  • 100% Tested for Quiescent Current at 20 V
  • Maximum Input Current of 1µA at 18 V Over Full Package Temperature Range, 100 nA at 18 V and 25°C
  • 5-V, 10-V, and 15-V Parametric Ratings
  • ESD Protection Level Per AEC-Q100 Classification
    • 2000-V (H2) Human-Body Model
    • 200-V (M3) Machine-Model
    • 1000-V (C5) Charge-Device Model
  • Applications
    • Wave and Pulse Shapers
    • High-Noise-Environment Systems
    • Monostable Multivibrators
    • Astable Multivibrators
    • NAND Logic
  • Qualified for Automotive Applications
  • Schmitt-Trigger Action on Each Input With No External Components
  • Hysteresis Voltage Typically 0.9 V at VDD = 5 V and 2.3 V at VDD = 10 V
  • Noise Immunity Greater Than 50%
  • No Limit on Input Rise and Fall Times
  • Standardized, Symmetrical Output Characteristics
  • 100% Tested for Quiescent Current at 20 V
  • Maximum Input Current of 1µA at 18 V Over Full Package Temperature Range, 100 nA at 18 V and 25°C
  • 5-V, 10-V, and 15-V Parametric Ratings
  • ESD Protection Level Per AEC-Q100 Classification
    • 2000-V (H2) Human-Body Model
    • 200-V (M3) Machine-Model
    • 1000-V (C5) Charge-Device Model
  • Applications
    • Wave and Pulse Shapers
    • High-Noise-Environment Systems
    • Monostable Multivibrators
    • Astable Multivibrators
    • NAND Logic

The CD4093B-Q1 consists of four Schmitt-trigger circuits. Each circuit functions as a two-input NAND gate, with Schmitt-trigger action on both inputs. The gate switches at different points for positive- and negative-going signals. The difference between the positive voltage (VP) and the negative voltage (VN) is defined as hysteresis voltage (VH)(see Figure 2).

The CD4093B-Q1 is available in 14-lead small-outline plastic package (M96) and 14-lead thin shrink small-outline packages (PWR suffixes).

The CD4093B-Q1 consists of four Schmitt-trigger circuits. Each circuit functions as a two-input NAND gate, with Schmitt-trigger action on both inputs. The gate switches at different points for positive- and negative-going signals. The difference between the positive voltage (VP) and the negative voltage (VN) is defined as hysteresis voltage (VH)(see Figure 2).

The CD4093B-Q1 is available in 14-lead small-outline plastic package (M96) and 14-lead thin shrink small-outline packages (PWR suffixes).
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类型 标题 下载最新的英语版本 日期
* 数据表 CMOS Quad 2-Input NAND Schmitt-Trigger 数据表 (Rev. A) 2008年 4月 24日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
用户指南 Signal Switch Data Book (Rev. A) 2003年 11月 14日
应用手册 Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 2001年 12月 3日

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包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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  • 封装厂地点

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