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CD40107B

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具有开漏输出的 2 通道、双输入、3V 至 18V 与非门

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数据表

CD40107B

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数据表 立即订购

产品详情

Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Number of channels 2 Inputs per channel 2 IOL (max) (mA) 89 IOH (max) (mA) 0 Input type Standard CMOS Output type Open-drain Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 8 Rating Catalog Operating temperature range (°C) -55 to 125
Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Number of channels 2 Inputs per channel 2 IOL (max) (mA) 89 IOH (max) (mA) 0 Input type Standard CMOS Output type Open-drain Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 8 Rating Catalog Operating temperature range (°C) -55 to 125
PDIP (P) 8 92.5083 mm² 9.81 x 9.43 SOIC (D) 8 29.4 mm² 4.9 x 6 SOP (PS) 8 48.36 mm² 6.2 x 7.8 TSSOP (PW) 8 19.2 mm² 3 x 6.4
  • 32 times standard B-Series output current drive sinking capability - 136 mA typ. @ VDD = 10 V, VDS = 1 V
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • 5-V, 10-V, and 15-V parametric ratings
  • Noise margin, full package temperature range, RL to VDD = 10 k:
       1 V at VDD = 5 V
       2 V at VDD = 10 V
       2.5 V at VDD = 15 V
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of 'B' Series CMOS Devices"
  • Applications
    • Driving relays, lamps, LEDs
    • Line driver
    • Level shifter (up or down)
  • 32 times standard B-Series output current drive sinking capability - 136 mA typ. @ VDD = 10 V, VDS = 1 V
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • 5-V, 10-V, and 15-V parametric ratings
  • Noise margin, full package temperature range, RL to VDD = 10 k:
       1 V at VDD = 5 V
       2 V at VDD = 10 V
       2.5 V at VDD = 15 V
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of 'B' Series CMOS Devices"
  • Applications
    • Driving relays, lamps, LEDs
    • Line driver
    • Level shifter (up or down)

The CD40107B is a dual 2-input NAND buffer/driver containing two independent 2-input NAND buffers with open-drain single n-channel transistor outputs. This device features a wired-OR capability and high output sink current capability (136 mA typ. at VDD = 10 V, VDS= 1 V). The CD40107B is supplied in 8-lead hermetic dual-in-line ceramic packages (F3A suffix), 8-lead dual-in-line plastic packages (E suffix), 8-lead small-outline packages (M, M96, MT, and PSR suffixes), and 8-lead thin shrink small-outline packages (PW and PWR suffixes).

The CD40107B is a dual 2-input NAND buffer/driver containing two independent 2-input NAND buffers with open-drain single n-channel transistor outputs. This device features a wired-OR capability and high output sink current capability (136 mA typ. at VDD = 10 V, VDS= 1 V). The CD40107B is supplied in 8-lead hermetic dual-in-line ceramic packages (F3A suffix), 8-lead dual-in-line plastic packages (E suffix), 8-lead small-outline packages (M, M96, MT, and PSR suffixes), and 8-lead thin shrink small-outline packages (PW and PWR suffixes).
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技术文档

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类型 标题 下载最新的英语版本 日期
* 数据表 CD40107B TYPES 数据表 (Rev. D) 2003年 10月 13日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
用户指南 Signal Switch Data Book (Rev. A) 2003年 11月 14日
应用手册 Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 2001年 12月 3日

设计和开发

如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。

仿真模型

CD40107B PSPICE Model (Rev. A)

SCHM030A.ZIP (7 KB) - PSpice Model
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封装 引脚 下载
PDIP (P) 8 查看选项
SOIC (D) 8 查看选项
SOP (PS) 8 查看选项
TSSOP (PW) 8 查看选项
应遵守 TI 评估类商品的标准条款与条件。

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

支持和培训

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