产品详情

Technology family CD4000 Number of channels 4 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Inputs per channel 2 IOL (max) (mA) 6.8 IOH (max) (mA) -6.8 Output type Push-Pull Input type Standard CMOS Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 8 Rating Catalog Operating temperature range (°C) -55 to 125
Technology family CD4000 Number of channels 4 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Inputs per channel 2 IOL (max) (mA) 6.8 IOH (max) (mA) -6.8 Output type Push-Pull Input type Standard CMOS Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 8 Rating Catalog Operating temperature range (°C) -55 to 125
PDIP (N) 14 181.42 mm² 19.3 x 9.4 SOIC (D) 14 51.9 mm² 8.65 x 6 SOP (NS) 14 79.56 mm² 10.2 x 7.8 TSSOP (PW) 14 32 mm² 5 x 6.4
  • Propagation delay time = 60 ns (typ.) at CL = 50 pF, VDD = 10 V
  • Buffered inputs and outputs
  • Standardized symmetrical output characteristics
  • 100% tested for maximum quiescent current at 20 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Noise margin (over full package temperature range):
         1 V at VDD = 5 V
         2 V at VDD = 10 V
      2.5 V at VDD = 15 V
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"

Data sheet acquired from Harris Semiconductor

  • Propagation delay time = 60 ns (typ.) at CL = 50 pF, VDD = 10 V
  • Buffered inputs and outputs
  • Standardized symmetrical output characteristics
  • 100% tested for maximum quiescent current at 20 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Noise margin (over full package temperature range):
         1 V at VDD = 5 V
         2 V at VDD = 10 V
      2.5 V at VDD = 15 V
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"

Data sheet acquired from Harris Semiconductor

CD4001B, CD4002B, and CD4025B NOR gates provide the system designer with direct implementation of the NOR function and supplement the existing family of CMOS gates. All inputs and outputs are buffered.

The CD4001B, CD4002B, and CD4025B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).

CD4001B, CD4002B, and CD4025B NOR gates provide the system designer with direct implementation of the NOR function and supplement the existing family of CMOS gates. All inputs and outputs are buffered.

The CD4001B, CD4002B, and CD4025B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).

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类型 标题 下载最新的英语版本 日期
* 数据表 CD4001B, CD4002B, CD4025B Types 数据表 (Rev. C) 2003年 8月 21日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
用户指南 Signal Switch Data Book (Rev. A) 2003年 11月 14日
应用手册 Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 2001年 12月 3日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

评估板

14-24-LOGIC-EVM — 采用 14 引脚至 24 引脚 D、DB、DGV、DW、DYY、NS 和 PW 封装的逻辑产品通用评估模块

14-24-LOGIC-EVM 评估模块 (EVM) 旨在支持采用 14 引脚至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。

用户指南: PDF | HTML
英语版 (Rev.B): PDF | HTML
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仿真模型

CD4001B PSPICE Model (Rev. A)

SCHM025A.ZIP (7 KB) - PSpice Model
封装 引脚 下载
PDIP (N) 14 查看选项
SOIC (D) 14 查看选项
SOP (NS) 14 查看选项
TSSOP (PW) 14 查看选项

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

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