ZHCSGW5A January 2017  – August 2017 CC2640R2F-Q1

PRODUCTION DATA. 

  1. 1器件概述
    1. 1.1特性
    2. 1.2应用
    3. 1.3说明
    4. 1.4功能框图
  2. 2修订历史记录
  3. 3 Device Comparison
    1. 3.1Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1Pin Diagram - RGZ Package
    2. 4.2Signal Descriptions - RGZ Package
    3. 4.3Wettable Flanks
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Power Consumption Summary
    5. 5.5 General Characteristics
    6. 5.6 1-Mbps GFSK (Bluetooth low energy Technology) - RX
    7. 5.7 1-Mbps GFSK (Bluetooth low energy Technology) - TX
    8. 5.8 24-MHz Crystal Oscillator (XOSC_HF)
    9. 5.9 32.768-kHz Crystal Oscillator (XOSC_LF)
    10. 5.1048-MHz RC Oscillator (RCOSC_HF)
    11. 5.1132-kHz RC Oscillator (RCOSC_LF)
    12. 5.12ADC Characteristics
    13. 5.13Temperature Sensor
    14. 5.14Battery Monitor
    15. 5.15Continuous Time Comparator
    16. 5.16 Low-Power Clocked Comparator
    17. 5.17Programmable Current Source
    18. 5.18Synchronous Serial Interface (SSI)
    19. 5.19DC Characteristics
    20. 5.20Thermal Resistance Characteristics for RGZ Package
    21. 5.21Timing Requirements
    22. 5.22Switching Characteristics
    23. 5.23Typical Characteristics
  6. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Main CPU
    4. 6.4 RF Core
    5. 6.5 Sensor Controller
    6. 6.6 Memory
    7. 6.7 Debug
    8. 6.8 Power Management
    9. 6.9 Clock Systems
    10. 6.10General Peripherals and Modules
    11. 6.11System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1Application Information
    2. 7.27 × 7 Internal Differential (7ID) Application Circuit
      1. 7.2.1Layout
  8. 8器件和文档支持
    1. 8.1 器件命名规则
    2. 8.2 工具和软件
    3. 8.3 文档支持
    4. 8.4 德州仪器 (TI) 低功耗射频网站
    5. 8.5 社区资源
    6. 8.6 其他信息
    7. 8.7 商标
    8. 8.8 静电放电警告
    9. 8.9 出口管制提示
    10. 8.10术语表
  9. 9机械、封装和可订购信息
    1. 9.1封装信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGZ|48
订购信息

Application, Implementation, and Layout

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

Application Information

Very few external components are required for the operation of the CC2640R2F-Q1 device. This section provides general information about the differential configuration when using the CC2640R2F-Q1 device in an application, and an example application circuit with schematics and layout is shown in Figure 7-1, Figure 7-2, Figure 7-3, and Figure 7-4. This is only a small selection of the many application circuit examples available as complete reference designs from the product folder on www.ti.com.

Figure 7-1 shows the differential RF front-end configuration option with internal biasing. See the CC2640Q1EM-7ID reference design for this option.

CC2640R2F-Q1 CC2640R2Q1_Application_Diagram.gif Figure 7-1 CC2640R2F-Q1 Application Circuit

Figure 7-2 shows the various supply voltage configuration options for the CC2640R2F-Q1 device. Not all power supply decoupling capacitors or digital I/Os are shown. For a detailed overview of power supply decoupling and wiring, see the TI reference designs and the CC13x0, CC26x0 SimpleLink Wireless MCU Technical Reference Manual.

CC2640R2F-Q1 CC2640R2Q1_Supply_Voltage_Config.gif Figure 7-2 Supply Voltage Configurations

7 × 7 Internal Differential (7ID) Application Circuit

CC2640R2F-Q1 swrs201a-shematic-pdf.gif Figure 7-3 7 × 7 Internal Differential (7ID) Application Circuit

Layout

CC2640R2F-Q1 CC2640R2Q1_7ID_layout.png Figure 7-4 Layout