ZHCSGW5A January 2017  – August 2017 CC2640R2F-Q1

PRODUCTION DATA. 

  1. 1器件概述
    1. 1.1特性
    2. 1.2应用
    3. 1.3说明
    4. 1.4功能框图
  2. 2修订历史记录
  3. 3 Device Comparison
    1. 3.1Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1Pin Diagram - RGZ Package
    2. 4.2Signal Descriptions - RGZ Package
    3. 4.3Wettable Flanks
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Power Consumption Summary
    5. 5.5 General Characteristics
    6. 5.6 1-Mbps GFSK (Bluetooth low energy Technology) - RX
    7. 5.7 1-Mbps GFSK (Bluetooth low energy Technology) - TX
    8. 5.8 24-MHz Crystal Oscillator (XOSC_HF)
    9. 5.9 32.768-kHz Crystal Oscillator (XOSC_LF)
    10. 5.1048-MHz RC Oscillator (RCOSC_HF)
    11. 5.1132-kHz RC Oscillator (RCOSC_LF)
    12. 5.12ADC Characteristics
    13. 5.13Temperature Sensor
    14. 5.14Battery Monitor
    15. 5.15Continuous Time Comparator
    16. 5.16 Low-Power Clocked Comparator
    17. 5.17Programmable Current Source
    18. 5.18Synchronous Serial Interface (SSI)
    19. 5.19DC Characteristics
    20. 5.20Thermal Resistance Characteristics for RGZ Package
    21. 5.21Timing Requirements
    22. 5.22Switching Characteristics
    23. 5.23Typical Characteristics
  6. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Main CPU
    4. 6.4 RF Core
    5. 6.5 Sensor Controller
    6. 6.6 Memory
    7. 6.7 Debug
    8. 6.8 Power Management
    9. 6.9 Clock Systems
    10. 6.10General Peripherals and Modules
    11. 6.11System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1Application Information
    2. 7.27 × 7 Internal Differential (7ID) Application Circuit
      1. 7.2.1Layout
  8. 8器件和文档支持
    1. 8.1 器件命名规则
    2. 8.2 工具和软件
    3. 8.3 文档支持
    4. 8.4 德州仪器 (TI) 低功耗射频网站
    5. 8.5 社区资源
    6. 8.6 其他信息
    7. 8.7 商标
    8. 8.8 静电放电警告
    9. 8.9 出口管制提示
    10. 8.10术语表
  9. 9机械、封装和可订购信息
    1. 9.1封装信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGZ|48
订购信息

Device Comparison

Table 3-1 Device Family Overview

DEVICEPHY SUPPORTFLASH
(KB)
RAM
(KB)
GPIOPACKAGE(1)
CC2640R2F-Q1(2)Bluetooth low energy (Automotive)1282031RGZ (Wettable Flanks)
CC2640R2Fxxx(2)Bluetooth low energy (Normal, High Speed, Long Range)1282031, 15, 14, 10RGZ, RHB, YFV, RSM
CC2650F128xxxMulti-Protocol1282031, 15, 10RGZ, RHB, RSM
CC2640F128xxxBluetooth low energy (Normal)1282031, 15, 10RGZ, RHB, RSM
CC2630F128xxxIEEE 802.15.4 (ZigBee®/6LoWPAN)1282031, 15, 10RGZ, RHB, RSM
CC2620F128xxxIEEE 802.15.4 (RF4CE)1282031, 10RGZ, RSM
Package designator replaces the xxx in device name to form a complete device name, RGZ is 7-mm × 7-mm VQFN48, RHB is 5-mm × 5-mm VQFN32, RSM is 4-mm × 4-mm VQFN32, and YFV is 2.7-mm × 2.7-mm DSBGA.
CC2640R2Fxxx devices contain Bluetooth 4.2 Host and Controller libraries in ROM, leaving more of the 128KB of flash available for
the customer application when used with supported BLE-Stack software protocol stack releases. Actual use of ROM and flash by
the protocol stack may vary depending on device software configuration. See Bluetooth low energy Stack for more details.

Table 3-2 Typical(1) Flash Memory Available for Customer Applications

DeviceSimple BLE Peripheral (BT 4.0)(2) Simple BLE Peripheral (BT 4.2)(2)(3)
CC2640R2Fxxx, CC2640R2F-Q1(4)83 KB80 KB
CC2640F128xxx, CC2650F128xxx41 KB31 KB
Actual use of ROM and flash by the protocol stack will vary depending on device software configuration. The values in this table are provided as guidance only.
Application example with two services (GAP and Simple Profile). Compiled using IAR.
BT4.2 configuration including Secure Pairing, Privacy 1.2, and Data Length Extension
Bluetooth low energy applications running on the CC2640R2F-Q1 device make use of up to 115 KB of system ROM and up to 32 KB of RF Core ROM in order to minimize the flash usage. The maximum amount of nonvolatile memory available for Bluetooth low energy applications on the CC2640R2F-Q1 device is thus 275 KB (128-KB flash + 147-KB ROM).

Related Products

    Wireless Connectivity The wireless connectivity portfolio offers a wide selection of low power RF solutions suitable for a broad range of applications. The offerings range from fully customized solutions to turn key offerings with pre-certified hardware and software (protocol).
    Companion Products Review products that are frequently purchased or used in conjunction with this product.
    SimpleLink™ CC2640R2 Wireless MCU LaunchPad™ Development Kit
    The CC2640R2 LaunchPad ™ development kit brings easy Bluetooth low energy (BLE) connection to the LaunchPad ecosystem with the SimpleLink ultra-low power CC26xx family of devices. Compared to the CC2650 LaunchPad, the CC2640R2 LaunchPad provides the following:

    • More free flash memory for the user application in the CC2640R2 wireless MCU
    • Out-of-the-box support for Bluetooth 4.2 specification
    • 4× faster over-the-air download speed compared to Bluetooth 4.1

    SimpleLink™ Bluetooth low energy/Multistandard SensorTag
    The SensorTag IoT kit invites you to realize your cloud-connected product idea. The SensorTag includes 10 low-power MEMS sensors in a tiny red package, and it is expandable with DevPacks to make it easy to add your own sensors or actuators.
    Reference Designs for CC2640 TI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor and connectivity. Created by TI experts to help you jump-start your system design, all TI Designs include schematic or block diagrams, BOMs and design files to speed your time to market. Search and download designs at ti.com/tidesigns.